BGA200 LPDDR Test Socket with Zero-Footprint Design for LPDDR4/5 - 10,000+ Cycle Durability
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MOQ:
1
Delivery Time:
Negotiable
Brand:
Sireda
Product Description
Ultra Compact LPDDR Test Socket for BGA200 Packages
Revolutionary Zero-Footprint Design
Our ultra-low-profile test socket eliminates traditional testing hassles with its innovative direct-solder design, providing seamless integration for LPDDR memory testing applications.
Key Benefits
- No PCB Modifications Required - Interposer matches exact chip footprint
- Two Testing Options Available:
- F Series: Simple direct-contact design
- F1 Series: With test points for signal/power analysis
- High-Speed Performance: Optimized for LPDDR4/5 performance validation
- Exceptional Durability: 10,000+ insertion cycle lifespan
Ideal Applications
- Memory manufacturers (production testing)
- Validation labs (quick device verification)
- R&D teams (prototype debugging)
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details.
Compatible Package Types
| UFS | eMCP | eMMC | DDR | LPDDR | NAND |
|---|---|---|---|---|---|
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | BGA162 | BGA96 | BGA315 | BGA136 | |
| BGA169 | BGA152 | ||||
| BGA100 | BGA154 | ||||
| BGA254 |
F Series vs F1 Series Comparison
Installation Procedure
Step 1: Solder interposer to test board
Step 2: Attach test socket assembly
Step 3: Insert chip and lock cover
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Sireda Technology Co., Ltd.
Location
Floor 6, Building 4, 10th Industry Park, GM Tianliao, Guangming New District, Shenzhen, PRC
Contact Person
Wang