eMMC Test Socket BGA100 BGA153 Zero Footprint Design 10,000+ Cycles for Memory Chip Testing
Price:
Get Quote
MOQ:
1
Delivery Time:
Negotiable
Brand:
Sireda
Product Description
High-Performance Zero-Footprint eMMC Test Sockets
Our ultra-compact eMMC test sockets provide fast, reliable testing solutions with direct-solder design, requiring no PCB modifications for hassle-free validation of embedded memory chips.
Key Product Features
- Perfect chip-sized interposer matching BGA100 & BGA153 footprints precisely
- No PCB cutouts required - solder directly onto test boards for instant use
- Two versions for different testing needs: F Series (standard contact-only) and F1 Series (enhanced with test points)
- High-speed compatibility supporting eMMC 5.1 & UFS interface validation
- Durable construction with over 10,000 mating cycles
Application Scenarios
Ideal for manufacturers conducting production testing on eMMC chips, R&D teams validating board-level eMMC performance, and repair & debugging labs analyzing signal integrity.
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details.
Available Socket Configurations
| UFS | eMCP | eMMC | DDR | LPDDR | NAND |
|---|---|---|---|---|---|
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | BGA162 | BGA96 | BGA315 | BGA136 | |
| BGA169 | BGA152 | ||||
| BGA100 | BGA154 | ||||
| BGA254 |
F vs F1 Solution Comparison
Installation Procedure
Simple 3-Step Installation
- Solder interposer to test board
- Attach test socket assembly
- Insert chip and lock cover
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Sireda Technology Co., Ltd.
Location
Floor 6, Building 4, 10th Industry Park, GM Tianliao, Guangming New District, Shenzhen, PRC
Contact Person
Wang