TO63-03A Hermetic Sealing Package for Power Devices
Price:
Bargain
MOQ:
100
Delivery Time:
A WEEK
Brand:
HUONA
Product Description
TO63-03A Hermetic Sealing Package for Power Devices
Product Attributes
| Attribute | Value |
|---|---|
| Housing Material | Kovar alloy or 304 stainless steel |
| Number of Pins | 3 pins (customizable to 4, 6,8 etc.) |
| Plating Options | Nickel, Gold (0.5–2μm thickness) |
| Glass Insulator | Borosilicate or high-insulation custom glass |
| Hermeticity | ≤1×10⁻⁸ atm·cc/sec (He leak test) |
| Dimensional Customization | Available upon customer drawings |
Product Overview
Product Name: TO63-03A Hermetic Sealing Package
Model Number: TO63-03A
Package Type: TO-style metal can (Transistor Outline)
Sealing Technology: Glass-to-Metal Sealing (GTMS)
Materials:
- Housing: Kovar alloy (Fe-Ni-Co) or stainless steel
- Pins: Kovar, Dumet, or custom conductive materials
- Insulation Medium: Borosilicate or high-insulation glass
Key Features & Advantages
- Excellent hermeticity with leak rate ≤1×10⁻⁸ atm*cc/sec (helium leak test), suitable for aerospace, defense, and high-reliability applications
- Wide temperature range from -55°C to +300°C for use in extreme environments
- Strong mechanical structure with high resistance to vibration and shock
- Effective thermal path through the TO-style metal base, ideal for power components and heat-sensitive devices
- Full customization available: pin configuration, plating thickness, housing size, materials, etc.
Technical Specifications (Customizable)
| Item | Specification / Range |
|---|---|
| Housing Material | Kovar alloy or 304 stainless steel |
| Number of Pins | 3 pins (customizable to 4, 6,8 etc.) |
| Plating Options | Nickel, Gold (0.5-2μm thickness) |
| Glass Insulator | Borosilicate or high-insulation custom glass |
| Hermeticity | ≤1×10⁻⁸ atm*cc/sec (He leak test) |
| Operating Temp. | -55°C to +300°C |
| Surface Finish | Nickel plated, gold plated, or blackened |
| Dimensional Customization | Available upon customer drawings |
| Packaging | Vacuum sealed, anti-static bag, foam tray |
Application Fields
- Laser diode and VCSEL packaging
- Infrared sensor and detector modules
- Power electronics: IGBT, MOSFET, and high-current transistors
- RF and microwave device packaging
- Medical sensor modules requiring hermetic enclosures
- Aerospace, defense, and industrial electronics
Available Documentation & Support
- 2D/3D drawings in PDF or STEP format
- Helium leak and material composition reports
- RoHS and REACH compliance certificates
- OEM/ODM customization available from prototype to volume
- Technical consulting for packaging layout, sealing process, and thermal design
- Our R & D department design your product following your own specifications
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Huona (Shanghai) New Material Co., Ltd.
Location
1900 Mudanjiang Road, Baoshan District, 201999, Shanghai, China
Contact Person
Roy