4-Layer Blind Plate PCB 1.2mm Thick Multilayer Circuit Board for HDI Applications
Price:
USD+negotiable+pcs
MOQ:
1 PCS
Delivery Time:
1-7 days
Brand:
GS
Product Description
4-Layer Blind Plate PCB Manufacturing
Professional multilayer circuit board manufacturing with advanced blind plate technology for high-density interconnect applications.
Key Specifications
| Parameter | Specification |
|---|---|
| Number of Layers | 4 Layers |
| Board Thickness | 1.2mm |
| Technology | Blind Plate |
| Application | High-Density Interconnect (HDI) |
Technical Features
- Advanced blind plate technology for enhanced signal integrity
- 1.2mm thickness for optimal mechanical stability
- 4-layer construction supporting complex circuit designs
- Compatible with SMT assembly processes
- Suitable for prototype and production volumes
- Professional PCB fabrication with quality assurance
Applications
Ideal for telecommunications equipment, industrial control systems, medical devices, automotive electronics, and consumer electronics requiring high-density interconnect solutions.
Manufacturing Capabilities
Our PCB manufacturing process includes advanced etching techniques, precise copper plating, professional solder mask application, and comprehensive testing methods to ensure reliable performance in demanding applications.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Global Soul Limited
Location
Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person
Yi Lee