6 Layer Half Orifice Plate for PCB Manufacturing - HDI Multilayer Circuit Board Fabrication Tool
Price:
USD+negotiable+pcs
MOQ:
1 PCS
Delivery Time:
30 days
Brand:
GS
Product Description
6 Layer Half Orifice Plate for PCB Manufacturing
Essential component for advanced PCB manufacturing processes, designed to support high-density interconnect technology and precision circuit board fabrication.
Product Overview
This 6-layer half orifice plate is a critical tool in modern PCB manufacturing, specifically engineered to facilitate the production of multilayer printed circuit boards with enhanced precision and reliability.
Key Features
- 6-layer construction for complex circuit designs
- Half orifice design for specialized manufacturing applications
- Compatible with HDI PCB technology and high-density interconnects
- Supports advanced PCB fabrication processes including SMT assembly
- Ideal for prototype PCB manufacturing and rapid production cycles
- Enables precise layer alignment and via technology implementation
Technical Specifications
| Parameter | Specification |
|---|---|
| Layer Count | 6 Layers |
| Application | PCB Manufacturing & Fabrication |
| Technology Support | HDI, Multilayer PCB, SMT Assembly |
| Design Type | Half Orifice Plate |
| Compatible Processes | PCB Etching, Copper Plating, Solder Mask Application |
Applications
This half orifice plate is specifically designed for use in:
- Multilayer PCB fabrication and prototyping
- High-density interconnect (HDI) PCB manufacturing
- Surface mount technology (SMT) assembly processes
- Rigid-flex PCB production and circuit board testing
- PCB design validation and manufacturing quality control
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Global Soul Limited
Location
Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person
Yi Lee