14 Layers 1 Level HDI PCB with 2.0mm Thickness for High-Density Interconnect Applications
Price:
USD+negotiable+pcs
MOQ:
1PCS
Delivery Time:
5-15 days
Brand:
GS
Product Description
14-Layer 1-Level HDI PCB Manufacturing
Advanced 14-layer printed circuit board with 1-level High Density Interconnect technology, designed for complex electronic applications requiring superior performance and reliability.
Key Specifications:
• Board Thickness: 2.0mm
• Material: Shengyi TG170
• Surface Finish: Gold Plating
• Impedance Control: Standard
• Line Spacing: 3/3mil
• Via Technology: Laser Drilling
• Board Thickness: 2.0mm
• Material: Shengyi TG170
• Surface Finish: Gold Plating
• Impedance Control: Standard
• Line Spacing: 3/3mil
• Via Technology: Laser Drilling
Technical Features
- High Density Interconnect (HDI) technology for compact designs
- 14-layer construction for complex circuit routing
- Precision laser drilling for micro vias
- Impedance controlled signal integrity
- Gold surface finish for enhanced conductivity and corrosion resistance
- Shengyi TG170 high-performance laminate material
Application Capabilities
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Global Soul Limited
Location
Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person
Yi Lee