Multi Layer High Frequency PCB with 3mil/3mil Line Spacing and 1oz-5oz Copper Weight for Communication Devices

Price Negotiable

Price: Negotiable

MOQ: 10pcs

Delivery Time: 7-10 days

Brand: LJC

Product Description

Product Overview

Multi-layer high frequency PCB with immersion silver surface finish, engineered for superior performance in communication devices operating above 1 GHz. Manufactured with precision specifications including 3mil/3mil line width/spacing and flexible copper weight options.

Technical Specifications

Parameter	Specification
Copper Weight (Inner Layers)	1/2 Oz - 4oz
Copper Weight (Outer Layers)	1oz - 5oz
Final Foil	1 Oz
Minimum Line Width/Spacing	3mil / 3mil
Tolerance	±10%
Surface Finish Options	HASL, ENIG, Immersion Silver, OSP

Key Features

High-Frequency Performance

Optimized for frequencies above 1 GHz with minimal signal loss and interference

Precision Manufacturing

3mil minimum line width and spacing for intricate circuit layouts

Flexible Copper Options

Inner layers 1/2-4oz, outer layers 1-5oz for optimal conductivity

Multiple Surface Finishes

HASL, ENIG, Immersion Silver, and OSP options available

Applications

5G network infrastructure and communication systems
Satellite communications and aerospace electronics
RF/microwave applications and automotive radar
Medical devices and high-speed data processing equipment

Customization Services

Available customization includes surface finish selection (HASL, ENIG, Immersion Silver, OSP), copper weight specifications, and precision line width/spacing down to 3mil/3mil.

Technical Support

Expert consultation on design and material selection for high-frequency applications
PCB layout and stackup optimization for signal integrity
Testing and validation services for performance compliance
Troubleshooting assistance for high-frequency PCB issues