18 Layer FR4 Multilayer PCB for High Frequency Communications Test Equipment - 5.7mm Thickness, 0.2mm Min Hole Size
Price:
Negotiable
MOQ:
10pcs
Delivery Time:
7-10 days
Brand:
LJC
Product Description
18 Layer FR4 Multilayer PCB Overview
High-performance 18-layer printed circuit board engineered specifically for demanding high-frequency communications test equipment applications. This PCB delivers exceptional signal integrity and reliability in critical testing environments.
Technical Specifications
| Parameter | Specification |
|---|---|
| Layer Count | 18 Layers |
| Board Thickness | 5.7mm |
| Copper Weight | Inner Layers: 1OZ, Outer Layers: 1OZ |
| Surface Finish | Immersion Gold (ENIG) |
| Minimum Hole Size | 0.2mm |
| Minimum Trace Width/Spacing | 0.15mm / 0.2mm |
| Primary Application | Communication Test Equipment |
Key Features & Benefits
- High-Frequency Performance: Optimized for communication test equipment requiring stable signal transmission
- Robust Construction: 5.7mm thickness provides mechanical stability for complex multi-layer designs
- Precision Manufacturing: 0.2mm minimum hole size and 0.15mm trace width enable high-density component placement
- Reliable Surface Finish: Immersion gold ensures excellent solderability and corrosion resistance
- Consistent Copper Distribution: Uniform 1OZ copper weight throughout inner and outer layers
Application Details
Specifically designed for communication test board applications where signal integrity, thermal management, and long-term reliability are critical. Ideal for high-frequency testing equipment, signal analyzers, and communication system validation tools.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Pingxiang Lianjin Cheng Technology Co., Ltd
Location
Lianjincheng 5G Industrial Park, Ganxiang Cooperative Park, Jinshan Town Shangli County, Pingxiang City 337009, China
Contact Person
Alice