FR4 Copper Base PCB Board 3.0mm Thickness Thermoelectric Separation 2 Layer with 3/3 OZ Copper for Power Supply
Price:
Negotiable
MOQ:
10pcs
Delivery Time:
7-10 days
Brand:
LJC
Product Description
Product Overview
FR4 Copper Base PCB with 3.0mm thickness featuring advanced thermoelectric separation technology for high-power applications.
Technical Specifications
| Parameter | Specification |
|---|---|
| Layer Count | 2 Layers |
| Board Thickness | 3.0mm |
| Copper Weight | 3/3 OZ |
| Surface Finish | Immersion Gold |
| Minimum Hole Size | 0.5mm |
| Minimum Trace Width/Spacing | 0.25mm / 0.2mm |
| Primary Application | Power Supply Systems |
Key Features
- FR4 and copper block hybrid lamination construction
- Thermoelectric separation design for superior heat management
- Enhanced thermal conductivity for high-power applications
- Robust 3.0mm thickness for structural integrity
- 3/3 OZ copper weight for excellent current carrying capacity
Design Note: This board utilizes FR4 and copper block hybrid lamination technology, creating an advanced thermoelectric separation board ideal for demanding power supply applications requiring efficient heat dissipation and electrical performance.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Pingxiang Lianjin Cheng Technology Co., Ltd
Location
Lianjincheng 5G Industrial Park, Ganxiang Cooperative Park, Jinshan Town Shangli County, Pingxiang City 337009, China
Contact Person
Alice