8Gb C Die DRAM Memory Chip DDR4 SDRAM K4A8G165WC-BITD
| Attribute | Value |
|---|---|
| Product Catalogue | Memory > Dynamic Random Access Memory DRAM |
| Universal packaging | FBGA-96 |
| RoHS | Compliance |
| Installation method | Surface mount installation |
| Operating temperature | -40~95°C |
| Application grade | Industrial grade |
| Packaging method | Pallet |
| Storage capacity | 512Mx16 |
- JEDEC standard 1.2V (1.14V-1.26V) operation
- VDDo = 1.2V (1.14V-1.26V), VPp = 2.5V (2.375V-2.75V)
- Speeds up to 3200Mb/sec/pin (DDR4-3200)
- 8 Banks (2 Bank Groups) organization
- Programmable CAS Latency and CAS Write Latency
- 8-bit pre-fetch architecture
- Bi-directional Differential Data-Strobe
- Internal self calibration through ZQ pin (RZQ: 240 ohm±1%)
- On Die Termination using ODT pin
- Asynchronous Reset capability
- CRC (Cyclic Redundancy Check) for data security
- Command address parity check
- Data Bus Inversion (DBI) support
- Gear down mode available
- POD (Pseudo Open Drain) interface
Standard export packaging available. Customers can choose from cartons, wooden cases, and wooden pallets according to their requirements.
We typically provide quotations within 24 hours of receiving your inquiry (excluding weekends and holidays). For urgent pricing requests, please contact us directly via email or other available methods.
Delivery time depends on order quantity and season. Small batches typically ship within 7-15 days, while larger orders may require approximately 30 days.
Factory pricing with 30% deposit and 70% balance payment via T/T before shipment.
We offer sea, air, or express delivery (EMS, UPS, DHL, TNT, FEDEX). Please confirm your preferred shipping method before ordering.
We prioritize quality and competitive pricing to ensure customer satisfaction. We value every business relationship and approach all transactions with sincerity and professionalism.
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