Semi-Dicing System Ceramic Plate Cutting Machine with 300mm Capacity and 60,000 RPM Spindle for Semiconductor Processing
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Applications
This automatic dicing system is engineered for precision cutting of semiconductor chips, LED chips, EMC lead frames, PCBs, IR filters, sapphire glass, and ceramic thin plates.
Key Features
- Touch LCD interface with intuitive operation and multi-language support (Chinese, English, Korean)
- High-precision cutting capability for materials up to 300mm maximum diameter
- High-rigidity structural design ensuring cutting precision and process stability
- CCD automatic positioning and calibration system
- Real-time monitoring of air pressure, water pressure, and current values to prevent spindle damage
Technical Specifications
| Cutting Spindle | 2.4 kW × 1 set (Maximum: 60,000 RPM) |
| Repeat Positioning Accuracy | 0.001 mm |
| Cutting Speed Range | 0.05 - 400 mm/sec |
| Standard Blade Configuration | 2 Inch (Maximum: 3 Inch) |
Product Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
YUSH Electronic Technology Co.,Ltd
Location
5th Floor, No.10, Shanquan Road, Yongtou Village, Chang’an Town, Dongguan City, Guangdong province, China.
Contact Person
Eva Liu