High Density DTC Cold Aisle Enterprise Data Center Containment Solutions
The High-Density Cold Aisle Containment Solution is a purpose-built infrastructure designed to support the extreme thermal demands of AI Training Clusters and High-Performance Computing (HPC). Unlike standard IT containment, this "Liquid-Cooling Ready" system supports hybrid cooling architectures, allowing for the seamless integration of Direct-to-Chip (DTC) liquid cooling loops alongside traditional precision air cooling.
Engineered for Tier IV mission-critical environments, this solution handles power densities exceeding 15kW to 30kW per rack. It features reinforced structural load-bearing for heavy GPU servers, specialized piping pathways for coolant distribution, and smart environmental monitoring, making it the ideal foundation for next-generation LLM (Large Language Model) training facilities and scientific computing centers.
Product Family
| Configuration | IT Cabinets | Power / Cab | UPS System | Cooling Capacity | Refrigeration Type | Dimensions (L*W*H) |
|---|---|---|---|---|---|---|
| Plan 1 › | 12 Cabinets | 5 kW | 90K Rack Modular (15kVA modules, 4+1) |
25.5kW x 4 (3+1 Redundancy) |
In-Row AC | 4800 x 3600 x 2000 mm |
| Plan 2 › | 12 Cabinets | 5 kW | 120K Tower Modular (30kVA modules, 3+1) |
65.5kW x 2 (1+1 Redundant) |
In-Row AC | 4800 x 3600 x 2000 mm |
| Plan 3 › | 14 Cabinets | 5 kW | 120K Tower Modular (30kVA modules, 3+1) |
71.1kW x 1 (N Redundancy) |
Room-Level AC | 4800 x 3600 x 2000 mm |
| Plan 4 › | 14 Cabinets | 5 kW | 120K Tower Modular (30kVA modules, 3+1) |
Custom Capacity (Tailored) |
FAN WALL | 4800 x 3600 x 2000 mm |
| Plan 5 › | 18 Cabinets | 5 kW | Modular N+1 (25kVA modules, 4+1) |
31.1kW x 4 (3+1 Redundancy) |
In-Row AC | 6000 x 3600 x 2000 mm |
| Plan 6 › | 24 Cabinets | 5 kW | Modular N+1 (25kVA modules, 5+1) |
40.9kW x 4 (3+1 Redundancy) |
In-Row AC | 8400 x 3600 x 2000 mm |
| Custom › | ≤ 48 Cabinets | ≤ 15 kW | Max 500kVA (2N/N+1 Redundancy) |
Flexible Capacity (Row or Room) |
Air / Water / Chilled | Length ≤ 15000 mm |
Product Features
AI-Ready High-Density Infrastructure
Powering Next-Gen Compute: Our infrastructure is engineered to handle the extreme thermal demands of Generative AI and Large Language Models (LLMs). By integrating dedicated liquid cooling manifolds and ultra-high-capacity power busbars, the system supports power densities exceeding 100kW per rack, ensuring your facility is ready for the latest GPU architectures.
Architectural Adaptability & Hyperscale Power
Limitless Flexibility: Unlike rigid standard modules, we customize aisle width, height, and length (up to 48 racks) to fit irregular room shapes or existing support pillars, maximizing whitespace utilization for dense AI clusters.
Grid-Scale Power: Engineered with dual 400A+ busway inputs and 2N redundant Modular UPS systems to ensure uninterrupted power delivery for power-hungry AI training workloads and massive GPU clusters.
Full Series OF HIGH-DENSITY DATA CENTER SOLUTIONS
Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.
5-30 kW per Cabinet
Cold Aisle Data Center
Airtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads.
10-80 kW Total Power
20ft Container DC
Prefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios.
30-100 kW per Cabinet
40ft Cold Plate Container DC
Hybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption.
50-200 kW per Cabinet
40ft Immersion Container DC
Immersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters.
APPLICATIONS
Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.
FAQ
1. What defines a data center as "AI-Ready"?
2. How does the infrastructure support high-performance networking (RDMA)?
3. Can your AI-Ready racks support liquid cooling for NVIDIA Blackwell or H100 systems?
4. How do you handle the massive power surges associated with AI training loads?
5. Are these modules scalable for rapid "Day 2" expansions?
6. What is the maximum rack weight capacity for fully loaded AI servers?
7. How does AI-readiness impact the sustainability (PUE) of the facility?
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