Secure Data Transfer SHETIME TFW15-N1S1-2000-A T Flash Connector with UL498 Certification and Design

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Product Description

Dongguan Gaoyueda Electronics Co., Ltd. - T-Flash Connector Specification

This document specifies the performance and testing methods for the T-FLASH connector, designed and manufactured by Dongguan Gaoyueda Electronics Co., Ltd. This connector is suitable for applications requiring reliable data transfer via T-Flash cards.

Product Attributes

Brand: Dongguan Gaoyueda Electronics Co., Ltd.
Origin: China (Dongguan Factory), Taiwan (Taipei Factory)
Material: Compliant with RoHS directive for harmful materials.
Certifications: UL498 (Safety of attachment plug and receptacle)

Technical Specifications

Item	Requirements	Test Methods
Product Confirmation	Product shall be conforming to the requirements of applicable product drawing.	Visually, dimensions and functionally inspected per applicable product drawing.
Contact Resistance (Low Level)	80 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
Insulation Resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
Durability (Repeated Mating/Unmating)	10 cycles (pre-conditioned)	Samples are pre-conditioned with 10 cycles of durability. Each group shall be containing 5 test samples.
Solderability	Can meet MIL-STD-202F standard. Finish shall be free of contaminants.	N/A
Resistance to Solder Heat (Wave Soldering)	Preheat: Temp increase not to exceed 4/sec. Final preheat temp within 125 of solder temp. Soldering: Max 250 for 5 seconds. Cool Down: Ambient air to 20-25.	N/A
Resistance to Solder Heat (Infrared Reflow)	Preheat: Temp increase not to exceed 4/sec. Soldering: Max 90 sec above 183, max 260 for 10 seconds. Cool Down: Not to exceed 6/sec.	Note: Device temperature measurements are referenced from the top-center of the package outer surface.
Cleaning	Connectors resist to cleaning process. Aqueous Cleaning: Max 1 min exposure to 54-66 demineralized water at max 30 psi; followed by air drying for 60-90 seconds at 93-121.	N/A