Durable SHETIME TFW13-N1S1-2020-A T Flash Connector with Visual and Functional Inspection Compliance

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Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Specification: T-Flash type CONN. A/0

This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH. connector, which is designed and manufactured by the company. It is a T-Flash external welding type connector.

Product Attributes

Brand:
Taiwan Factory:
China Factory:
Material: Harmful material can follow the requirement of RoHS.
Certifications: UL498 (UL standard for safety of attachment plug and receptacle)
Origin: Taiwan & China

Technical Specifications

Item	Requirements	Test Methods
1. Confirmation of Product	Product shall be conforming to the requirements of applicable product drawing. Visually, dimensions and functionally inspected per applicable product drawing.	Visually, dimensions and functionally inspected per applicable product drawing.
2. Contact resistance (Low Level)	80 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
3. Insulation resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
4. Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
5. Durability (Repeated Mating/Unmating)	Contact Resistance: 100 m Max. after testing	Mate and unmate c
6. SOLDERABILITY	Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants.	MIL-STD-202F standard.
7. RESISTANCE TO SOLDER HEAT (SMT)	Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25.	SMT process
8. RESISTANCE TO SOLDER HEAT (INFRARED REFLOW)	Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second.	Infrared Reflow process
9. CLEANING (Aqueous Cleaning)	Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121.	Aqueous Cleaning process
10. STORAGE	Temperature: -25~+85, Relative humidity: 80%, Not to storage in corrosive environments. Re-qualification test shall be conducted immediately while the storage duration exceed 6 months.	Storage conditions
11. TRANSPORTATION	Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage.	Transportation conditions