Electrical and mechanical tested SHETIME TFC6A-N1S1-2000-A TF card connector designed for surface mounting

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Product Description

Product Overview

This specification defines the performance and test methods for the TFC6A-N1S1-2000-A TF card connector, designed for surface mounting. It is manufactured by DONGGUAN GAOYUEDA ELECTRONICS CO., LTD. and offers reliable electrical, mechanical, and environmental characteristics.

Product Attributes

Brand: TAIWAN FACTORY:
Origin: DONGGUAN GAOYUEDA ELECTRONICS CO., LTD. (China Factory), (Taiwan Factory)
Material: Conforms to RoHS directive.
Certifications: UL498 (Safety of attachment plug and receptacle)

Technical Specifications

Item	Requirements	Test Methods
Product Confirmation	Product shall be conforming to the requirements of applicable product drawing.	Visually, dimensions and functionally inspected per applicable product drawing.
Contact Resistance (Low Level)	80 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
Insulation Resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
Durability (Repeated Mating/Unmating)	Contact Resistance: 100 m Max. after testing	Mate and unmate connector for 5000 cycles.
Temperature Rise	30C Max.	Not specified in detail, implied by standard testing procedures.
Solderability	Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants.	Referenced MIL-STD-202F.
Resistance to Solder Heat (Wave Soldering)	Preheat: Not to exceed 4/sec, final preheat within 125 of solder temp. Soldering: Max 250 for 5 sec. Cool Down: Ambient air 20-25.	Specific parameters for wave soldering process.
Resistance to Solder Heat (Infrared Reflow)	Preheat: Not to exceed 4/sec. Soldering: Max 90 sec above 183, max 10 sec at 260. Cool Down: Not to exceed 6/sec.	Specific parameters for infrared reflow soldering process.
Cleaning	Connectors resist to cleaning process. Aqueous Cleaning: Max 1 min exposure to 54-66 demineralized water at max 30 psi; followed by air drying for 60-90 sec at 93-121.	Specific parameters for cleaning process.
Storage Conditions	Temperature: -25~+85, Relative humidity: 80%, Not to storage in corrosive environments. Re-qualification test required after 6 months.	Environmental storage requirements.
Transportation	Moisture-proof and no mechanical damage.	General transportation guidelines.