Silicone Potting Sealant
Hot Selling Two-Component Electrically Thermal Conductive Silicone Rubber Potting Compound Adhesive Sealant
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
High Performance PCB Component Thermally Conductive Silicone Potting Compound
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
HIgh quality Thermal Conductive Electronic Silicone Potting Compound Two Part LED PCB Silicone Rubber Potting Compound
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
HIgh quality High performance Two-Component Compound for Pouring Electronic Circuits
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
Two-Component Material High Thermal Conductivity Potting Compound Silicone Sealant
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
Waterproof, Thermal Conductivity Silicone Potting Compound for Electronics
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
Fast Cure 2 Parts Potting Compound Liquid Silicone Compound for Electronic Potting
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
High quality Grey Electrical Potting Silicone Compound for LED / Circuits Encapsulants
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
High Dielectric Strength Elastic Two-Component Potting Casting Compound for Electronics PCB EV Charger Casting Encapsula
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
High Temperature Waterproof PCB Liquid Silicon Epoxy Resin Rubber Electronic Components Potting Compound
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
Electronic Potting Silicone Compound RTV Silicone Encapsulants for Power Supplies
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins
Silicone Potting Sealant For Electronic Component High Temperature Waterproof Epoxy Resin for PCB Protection
TESTING ITEM ESTING STANDARD Part A Part B Color Visual inspection White / black viscous liquid White viscous liquid Viscosity, cps , 25℃ GB/T 10247-2008 2500±500 2300±500 Density,,g/cm3, 25℃ GB/T 15223-1994 1.63±0.05 1.63±0.05 Mixture ratio Weight Ratio A:B = 100:100 Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 2500±500 Operation time,mins , 25℃ GB/T 10247-2008 50±10 Tack free, mins, 25℃ GB/T 10247-2008 90±20 Cure condition GB/T 10247-2008 25℃/3-5 hr or 80℃/ 30mins