ED Copper Foil

very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit. Products Specifications. 1) Thickness Range: 0.035mm. 2) standard width:1290mm. 3) ID: 76 mm,152 mm. 4) Cu Content: 99.8%. VLP ED Copper Foil Characteristics. 1. Zinc-free. 2. Excellent physics of high elongation Performance. Products use: - Flexible Printed Circuit. - LED layer of HDI . Difference between rolled copper foil and electrolytic copper foil. Process is difference: rolled copper foil

black 35um Standard electrolytic copper foil for PCB Introduction The roll shape (from 1/3oz to 2oz thickness)width. In usual, it is from 500mm to 1295mm, the max width could reach to 1370mm. The normal sheet size is 1295mm*1295mm, 1295mm*1092mm, 1295mm*990mm. it also can be cut to the size as customer’s requirement. 1/3oz, 1/2oz, 1oz, 3oz, 12oz, 14oz are popular thickness, and we can also provide surface treatment service. Feature Perfect normal temperature storage

1oz ED electrolytic High ductility copper foil Their characteristics differ, and an understanding of these differences is important to ensure the correct selection of copper foil for each application or environmental condition. Thickness: 1OZ Width: 1380 mm Length: 500-5000 M ID: 76 mm,152 mm Purity:99.8% Manufacturing Process: In an electrodeposited copper manufacturing process, the copper foil is deposited on a titanium rotating drum from a copper solution where it is

High coarse electrodeposited ED electrolytic copper foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Purity:99.8% Features: 1. the treated foil in red 2. High peel strength 3. Anti foil cracking by high elongation at elevated temperature. 4. Eco-friendly products and processes 5. Good etch ability 6. Excellent adhesion to etching resist Application: Positive temperature coefficient resistance Compare between CA copper foil and

25um HD electrolytic ED copper foil for Polyimide board Overview: Rang of Thickness: 25micron Range of Width: 1380 mm Range of Length: 500-5000 M Available ID: 76 mm,152 mm Purity:99.8% Features of high ductility ED copper foil: 1. Good etch ability 2. Excellent adhesion to etching resist Classify : The ED copper foils for PCB can be divided into below parts: (STD-E)- standard electrodeposited copper foil (HD-E)-high ductility electrodeposited copper foil (HTE-E)-high

HD electrodeposited electrolytic ED copper foil(High ductility electrodeposited ED electrolytic copper foil) Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Purity:99.8% Features: 1. the treated foil in gray or red 1. High peel strength 3. Good etch ability 4. Excellent adhesion to etching resist Application: 1. Polyimide board 2. Epoxy board Compare between CA copper foil and ED copper foil 1. Process: rolled copper foil (Rolling

High coarse 25um electrolytic ED copper foil for coefficient resistance Overview: Cu foil Thickness: 12-7um Cu foil Width: 0.5-52Cm Cu foil Length: 500-5000 M Coil ID: 3 inch ,6 inch Purity:99.8% Mechanical Features: The treated foil in red High peel strength Anti foil cracking benefit by high elongation at elevated temperature. Eco-friendly Good etch ability Excellent adhesion to etching resist Application: Coefficient resistance Difference between CA Copper Foil and ED

Special Coefficient Resistance High Coarse Electrolytic Copper Foil Type High temperature elongation (THE) ED Copper Foils Thickness Range 1/3oz/ft²to 2oz/ft²(nominal thickness 12μm~70μm) Width Range 550~1295mm Performance The perfect normal temperature storage performance The high temperature anti-oxidization performance The high temperature elongation performance Quality standard Reach the Ⅱ and Ⅲ requirements of the international standard IPC-4562 Features: The treated

12 Micron EDCU Electrolytic Copper Foil Single Side Matte with Width 530 mm for Samsung Mobile Phone Quickly Info. Thickness:12um Width:530mm Application:Samsung mobile phone Standard:GB/T5230-1995,IPC-456 Single side matte /single side shiny Features: The treated foil in gray or red High peel strength Good etch ability Excellent adhesion to etching resist Typical Properties of Standard EDCU Copper Foil Classification Unit Requirement Test Method Foil Designation / T H M 1 2

Products Name 11um EDCU electrolytic copper foil one side matte for Samsung mobile phone Quickly info. 1. Thickness:11um 2. Width:standard width is 1290mm,can cut into as request. 3. Application:Samsung mobile phone 4. Standard:GB/T5230-1995,IPC-456 5. Single side matte /single side shiny Features: 3.Good etch ability 4.Excellent adhesion to etching resist Typical properties of Standard EDCU copper foil Classification Unit Requirement Test Method Foil Designation / T H M 1 2

Products Name 18 micron EDCU electrolytic copper foil single side type with width 530 mm for Samsung mobile phone Quickly info. 1. Thickness:18um,18 micron 2. Width:530mm 3. Application:Samsung mobile phone 4. Standard:GB/T5230-1995,IPC-456 5. Single side matte /single side shiny Features: 1.the treated foil in gray or red 2.High peel strength Typical properties of Standard EDCU copper foil for 18um Classification Unit Requirement Test Method Foil Designation / T H M 1 2 3

STD copper foil (Standard copper foil ) Features: 1.the treated foil in gray or red 2.High peel strength 3.Good etch ability 4.Excellent adhesion to etching resist Application: 1.Phenolic resin board 2.Epoxy board Typical properties of Standard copper foil Classification Unit Requirement Test Method Foil Designation / T H M 1 2 3 IPC-4562A Nominal thickness / 12um 1/2 OZ 3/4 OZ 1 OZ 2 OZ 3 OZ IPC-4562A Area Weight g/m2 107±4 153±5 228±8 285±10 580±15 860±20 IPC-TM-650 2.2.12

High temperature elongation HTE ED copper foil 12um thick with for RFPCB Products Detail:a. single side matte and one side shinyb. Nominal Thickness: 0.012mm.12umc. Standard width:1290mm and 645,430mmd. inner diameter: 76 mme. Name : High temperature elongation HTE ED copper foil 12um thick with for RFPCBf. Quality Standard:IPC 4562. Products use Application:1.Polyimide board2.Epoxy board3. RFPCB Description..Great adhesion to etching resist...Anti foil cracking by high

ED Copper Foil 35um 18um thickness for Rigid PCB with serving the high power board and EV charger. Products Detail: a. Single side matte and one side shiny b. Typical Thickness: 18um,35um c. Standard width:1290mm. accept customized d. ID: 76 mm f. Quality standard:IPC 4562. Products use Application: 1. Rigid PCB 2. Serving the high power board, EV charger.​ Standard ED copper foil Typical Properties Classification Unit Requirement Test Method Foil Designation - T H M 1 2 3

HTE 17um ED copper foil for High speed circuit with Good etch ability. Products Detail: a.single side side treatment low profile foil in back/red. b.Nominal Thickness: 0.017mm. c.Width: 5-1380mm,standard width:1290mm. d.ID: 76 mm,152 mm. e.Cu purity :99.8%. f.Quality standard:IPC 4562. Products use Application: 1.Polyimide board 2.Epoxy board 3.PCB and antenna PCB,FPC Description. .Excellent adhesion to etching resist.. .Anti foil cracking by high elongation at elevated

Products Name 12 Micron EDCU electrolytic copper foil with one side shiny type for Samsung mobile phone Quickly Description 1. Thickness:12um 2. Width:standard width: 1290mm,max.1380mm ,can be cut into as request. 3. Application:Samsung Mobile Phone 4. Standard:IPC-456 5. One side matte /another side shiny Standard EDCU copper foil Typical Properties Classification Unit Requirement Test Method Foil Designation - T H M 1 2 3 IPC-4562A Nominal thickness - 12um 1/2 OZ 3/4 OZ 1

very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit. Products Specifications. 1) Thickness Range: 0.035mm. 2) standard width:1290mm. 3) ID: 76 mm,152 mm. 4) Cu Content: 99.8%. VLP ED Copper Foil Characteristics. 1. Zinc-free. 2. Excellent physics of high elongation Performance. Products use: - Flexible Printed Circuit. - LED layer of HDI . Difference between rolled copper foil and electrolytic copper foil. Process is difference: rolled copper foil

very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit. Surface: Mill,mirror,brush,hair line,checkered .etc Main Purpose: Copper strip can be made to do all sorts of deep drawing and bending stress components, such as manufacturing pins,rivets, gasket, nuts, conduits, the barometer spring, screen, radiator parts, etc The product surface is black or red, has lower surface roughness,high density, high bending resistance and good etching performance, used

STD 18um electrolytic ED copper foil for Phenolic resin board specifications T: 18micron W: 5-1380 mm L: 500-5000 M ID: 76 mm,152 mm Features: 1. Good etch ability 2. Excellent adhesion to etching resist Application: Epoxy board Difference between CA copper foil and ED copper foil Density: rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high

High coarse 25um electrolytic ED copper foil for coefficient resistance Overview: Cu foil Thickness: 12-7um Cu foil Width: 0.5-52Cm Cu foil Length: 500-5000 M Coil ID: 3 inch ,6 inch Purity:99.8% Mechanical Features: The treated foil in red High peel strength Anti foil cracking benefit by high elongation at elevated temperature. Eco-friendly Good etch ability Excellent adhesion to etching resist Application: Coefficient resistance Difference between CA Copper Foil and ED