SMT Assembly Equipment

High-precision 3D SPI with 4-way digital fringe projection, 4/12 MP cameras, and 0.45 μm height resolution. Inspects up to 510x460 mm PCBs. Ideal for SMT lines demanding accuracy and speed. Supports custom options and global shipping.

High-speed 3D SPI with 4 Mpix camera, 0.4 µm height resolution, and 200 cm²/sec imaging speed. Detects insufficient/excess paste, bridging, and shape defects. Supports PCBs up to 510x460 mm. Reliable linear motor control. Ideal for precision SMT lines.

High-precision 3D SPI with 21 Mpix camera and 9.8 μm resolution. Detects insufficient/excess paste, bridging, and offset. Supports PCBs up to 510x460 mm. SMEMA compatible. Reliable for SMT lines.

High-speed 3D SPI with 4 Mpix camera and 0.4 µm height resolution. Detects insufficient/excess paste, bridging, and shape defects. Supports PCBs up to 510x460 mm. SMEMA compatible. Ideal for precision SMT lines.

High-speed AOI system for SMT assembly with 50cm inspection width. Features advanced defect detection, user-friendly software, and robust build. Supports custom options and global certifications for reliable quality control.

High-speed 3D SPI with 4 Mpix camera, 10 µm resolution, and 0.4 µm height accuracy. Detects insufficient/excess paste, bridging, and shape defects. Supports PCBs up to 350x350 mm. Ideal for precision SMT lines with reliable performance and SMEMA compatibility.

High-precision 3D SPI with 21 Mpix camera and 0.4 μm height resolution. Inspects solder paste defects like bridging and insufficient paste. Supports PCBs up to 510x460 mm. Ideal for SMT lines requiring reliable quality control.

The DESCO 19270 COMBO TESTER X3 provides reliable human body static testing for SMT machines. Features dual-wire monitoring, adjustable alarm thresholds, and NIST traceable calibration. Ideal for ESD-sensitive environments. Durable design with easy installation and optional remote indicator support.