Scientific Lab Equipment

Semiconductor Ion Implantation Equipment Ion implantation is the primary doping method in the semiconductor industry. It is a technique that injects specific elements into a target material by utilizing electric fields for acceleration, as well as magnetic fields for mass separation and beam collimation; through high-precision control, it ensures the uniformity of the implanted dose. Owing to its advantages—including precise control, anisotropic characteristics, and room

Silicon / Silicon Carbide (SiC) Wafer Four-Stage Linked Polishing Automation Line (Integrated Post-Polish Handling Line) Overview This Four-Stage Linked Polishing Automation Line is an integrated, in-line solution designed for post-polish / post-CMP operations of silicon and silicon carbide (SiC) wafers. Built around ceramic carriers (ceramic plates), the system combines multiple downstream tasks into one coordinated line—helping fabs reduce manual handling, stabilize takt

End-to-End Diamond Polishing & Fine Grinding Services | Precision Machining Solutions We provide professional contract diamond polishing and fine grinding services for precision finishing of various hard materials. Backed by advanced polishing equipment and an experienced technical team, we deliver high-efficiency, high-quality, and consistent diamond-processing solutions to meet demanding requirements across multiple industries. Key Advantages Precision Finishing: High

SiC Seed Coating–Bonding–Sintering Integrated Solution Precision Spray Coating • Center Alignment Bonding • Vacuum Debubbling • Carbonization/Sintering Consolidation Transform SiC seed bonding from operator-dependent work into a repeatable, parameter-driven process: controlled adhesive layer thickness, center alignment with airbag pressing, vacuum debubbling, and temperature/pressure-adjustable carbonization consolidation. Built for 6/8/12-inch production scenarios. Product

1. Overview The laser communication component and terminal series is designed to meet the next generation of satellite communication demands. Using advanced opto-mechanical integration and near-infrared laser technology, these products enable high-speed, reliable data transmission for both inter-satellite and satellite-to-ground links. Compared with traditional RF communication, laser communication provides significantly higher bandwidth, lower power consumption, and superior

Intelligent Robotic Polishing Machine Product Overview The intelligent robotic polishing machine is built on a six-axis industrial robot platform (KUKA or ABB), equipped with an electronic pressure cylinder, adjustable rotary axis, and multiple polishing heads (flexible airbag, rigid tool, wheel type). Integrated with proprietary polishing software and the robot control system, it enables high-precision optical polishing for large-diameter components. Applications cover flat

Robot Polishing Machine Overview of Robot Polishing Machine The Robot Polishing Machine is an advanced precision processing solution that combines a six-axis industrial robot (such as KUKA, ABB, or Staubli) with a high-performance polishing system. The Robot Polishing Machine is equipped with an electronic pressure cylinder and an adjustable rotary axis, enabling the use of flexible airbag polishing heads, rigid grinding heads, and wheel-type tools. With a precision worktable

Product Overview: This X-ray crystal orientation instrument is designed for high-precision alignment of the reference plane of single crystal rods using X-ray diffraction technology. It is capable of aligning the primary crystallographic plane (commonly the face) for rods with diameters of 2, 4, and 6 inches. The system supports both standard and custom orientations such as C or R planes, making it suitable for various semiconductor and crystal processing applications. Key

Three Station Diamond Single Line Cutting Machine SiC Sapphire Ceramics Overview of Three station diamond single line cutting machine This high-performance Three-Station Diamond Single Wire Cutting Machine is designed specifically for square cutting of hard and brittle materials. Featuring three independent workstations, it enables simultaneous cutting of three raw material blocks, greatly enhancing productivity and flexibility. The machine is suitable for large-size square

PI Tube Polyimide Tube flexibility, high tensile strength OD 0.3 0.4 0.4 Guide to PI Tube (Polyimide Tube): Flexibility, High Tensile Strength and Custom OD 0.3 0.4 0.4 mm Introduction: What is PI Tube (Polyimide Tube)? Polyimide tubes, commonly referred to as PI Tubes, represent one of the most advanced high-performance polymer tubing solutions available today. Known for their exceptional thermal stability, mechanical strength, and chemical resistance, PI tubes are

Product Introduction This series of calcination annealing furnaces is widely used for annealing sapphire crystal rods and wafers, sintering special ceramics, and other ultra-high temperature industries. It is an *ideal choice for major research institutions, universities, and quality inspection units. The electric annealing furnace adopts a split design for furnace control, using U-shaped molybdenum disilicide rods as heating elements. Annealing furnaces features PID

Product Introduction This series of calcination annealing furnaces is widely used for annealing sapphire crystal rods and wafers, sintering special ceramics, and other ultra-high temperature industries. It is an *ideal choice for major research institutions, universities, and quality inspection units. The electric annealing furnace adopts a split design for furnace control, using U-shaped molybdenum disilicide rods as heating elements. Annealing furnaces features PID

8-12 Inch Automatic Thinning Machine​ The ​8-12 Inch Automatic Thinning Machine​ is a cutting-edge solution designed for high-precision grinding, cutting, and material processing. Engineered for versatility and efficiency, this machine caters to diverse industrial needs, offering two configurations to handle workpieces ranging from ​4"-8" (0200 mm)​​ to ​8"-12" (0300 mm)​. This machine integrates advanced automation with robust mechanical design, ensuring exceptional accuracy

Automated Precision Dicing Machine​ ​High-Performance Solutions for Semiconductor, Electronics, and Precision Manufacturing The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics, glass, and composites. Engineered with dual-spindle technology, multi-axis control, and fully automated systems, this machine delivers unmatched accuracy and efficiency for applications like wafer dicing, FPC flexible

Product Overview This equipment is a high-efficiency, fully automated 8-inch vertical oxidation LPCVD furnace designed for mass production. It offers excellent film uniformity and repeatability, supports various oxidation, annealing, and LPCVD processes. The system features a 21-cassette automatic transfer with seamless MES integration, ideal for semiconductor manufacturing. Working Principle The furnace features a vertical tube structure and advanced low-oxygen micro

Micro-jet laser machine for Metal matrix composite processing wafer cutting dicing slicing Micro-jet Laser Equipment & Linear Motor for Wafer Dicing and Slicing Product Overview: The Micro-jet Laser Machine is a cutting-edge solution designed for high-precision processing of Metal Matrix Composites (MMCs), along with wafer cutting, dicing, and slicing. Utilizing advanced laser microjet (LMJ) technology, this machine provides a unique combination of laser energy and high-speed

Laser Drilling Machine: Precision Engineering for Glass Processing​ The ​laser drilling machine are innovative solutions designed to revolutionize glass processing across industries. Engineered with a ​​customized 532nm green laser​​, these systems deliver unparalleled precision, minimal thermal damage, and exceptional stability. Ideal for display glass, quartz, and semiconductor wafers, we ensures ​​non-contact processing​​ with crack rates as low as ​​0.1%​​, making it the

Product Overview This ceramic disc cleaning & waxing integrated machine combines one ceramic disc cleaner with dual ceramic disc mounters, designed for high-efficiency cleaning and wafer waxing in sapphire and semiconductor industries, achieving stable 99.9% yield rate. Technical Specifications Parameter Value Dimensions 7740×3390×2300mm (L×W×H) Power Supply AC380V, 50Hz, Total Power 90KW Pneumatic Supply 2m³/h, 0.4-0.5MPa Oil-free Dry Air Water Supply 2T/h @0.3MPa, ≥12MΩ·cm

Product Overview The Ultrafast Laser Rainbow Marking Machine is a high-end system utilizing ultrafast laser technology. It generates dynamic rainbow effects on mirror-like surfaces (e.g., stainless steel, PVD coatings) through nano-scale physical interference patterns created by high-peak-power lasers. The machine supports direct processing on metals and transfer printing to plastics/films, combining anti-counterfeiting and decorative functions. It is widely used in luxury

Abstract of UV Laser Marking Machines UV laser marking machines, known for their precision and versatility, have gained significant traction across multiple industries. This article provides a comprehensive overview of UV laser marking machines, including their working principles, key features, applications, and future trends. Working Principle of UV Laser Marking Machines Laser Generation: UV lasers are usually generated using solid-state lasers (such as Nd:YAG lasers) or