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Wafer Bonding

Others
2025-04-11
Discover the advanced Wafer Bonder Equipment designed for high-precision bonding of silicon carbide (SiC) wafers. This equipment supports room temperature and hydrophilic bonding for 4, 6, 8, and 12-inch wafers, ideal for SiC-Si and SiC-SiC applications. Perfect for power semiconductor manufacturing and research.