BGA Rework Station
High Precision BGA Rework Station 2600W with CCD Alignment ±0.01mm Mounting Accuracy for Mobile Phone Chip Repair
HS-700 BGA rework station features a CCD color optical alignment system and stepping motor for ±0.01mm mounting accuracy. With 2600W power, 5 work modes, and ±1°C temperature control, it ensures 99%+ repair success for mobile phone BGA chips.
Mobile Phone BGA Rework Station ±0.01mm Mounting Accuracy CCD Color Optical Alignment System
Precision BGA rework station with ±0.01mm mounting accuracy and ±1℃ temperature control. Features 5 work modes, 15" HD LCD monitor, and CCD color optical alignment system. Ideal for mobile phone motherboard repair with 99%+ success rate. Customizable options available.
High Precision K-Sensor BGA Rework Station ±0.01mm Mounting Accuracy ±1℃ Temperature Control for Mobile Phone Chip Repair
Professional BGA rework station with dual heating zones, ±1℃ temperature precision, and ±0.01mm mounting accuracy. Features K-sensor closed-loop control, 5 working modes, and real-time temperature curve display. Ideal for mobile phone chip repair and PCB rework.
5 Modes Stepping Motor CCD Color Align BGA Rework Station ±0.01mm Accuracy for Mobile Phone Repair
High precision BGA rework station with CCD color alignment and 5 working modes. Features ±0.01mm mounting accuracy, 2600W power, and K-sensor closed-loop temperature control. Ideal for mobile phone motherboard and chip repair with versatile PCB and BGA size support.
High Precision K-sensor BGA Rework Station 2600W 7in Touch Screen ±0.01mm Accuracy
Professional BGA rework station with K-sensor closed loop control, 7in HD touch screen, and ±0.01mm mounting accuracy. Supports semi-auto/manual modes, laser alignment, and PCB up to 140x160mm. Ideal for mobile phone motherboard repair.