Hybrid PCB
4-Layer Hybrid RF PCB Rogers RO3210 Substrate Silver and Gold Plating
This PCB is a 4-layer hybrid Rogers RO3210 circuit board engineered for high-frequency microwave applications. It adopts a symmetrical stack-up with dual RO3210 dielectric cores bonded by premium RO4450F prepreg, delivering a consolidated lamination thickness of 1.321mm. Constructed with an asymmetric copper structure, it features 1oz outer copper and 0.5oz inner copper to optimize current conduction and impedance performance. Equipped with green solder mask, white top
10-Layer Hybrid PCB RO4003C + RF4-370HR Mixed Dielectric Controlled Impedance Board
This PCB is a 10-layer mixed-dielectric multilayer circuit board adopting composite stacking of RO4003C ceramic hydrocarbon laminate and RF4-370HR high-Tg FR4 material. It features asymmetric mixed copper foils with 1oz outer copper and 1oz/0.5oz inner copper, with a finished lamination thickness of 1.618mm. Fitted with double-sided blue solder mask and white silkscreen, the board applies enhanced immersion gold treatment (135%-150% gold thickness). Equipped with precise