Hybrid PCB
8-layer Hybrid PCB Based on RO4350B and FR4 material with Blind Vias
This 8-layer high-frequency hybrid PCB adopts a composite substrate structure, with 10mil RO4350B high-frequency substrate on the top and bottom layers, and FR-4 Tg180 substrate in the middle. It perfectly balances excellent high-frequency signal performance and cost-effectiveness, strictly complies with IPC Class 3 quality standards, and is equipped with special processes such as metal edge wrapping, blind/buried vias and resin plugging. With precise structural control and
4-Layer Hybrid RF PCB Rogers RO3210 Substrate Silver and Gold Plating
This PCB is a 4-layer hybrid Rogers RO3210 circuit board engineered for high-frequency microwave applications. It adopts a symmetrical stack-up with dual RO3210 dielectric cores bonded by premium RO4450F prepreg, delivering a consolidated lamination thickness of 1.321mm. Constructed with an asymmetric copper structure, it features 1oz outer copper and 0.5oz inner copper to optimize current conduction and impedance performance. Equipped with green solder mask, white top
10-Layer Hybrid PCB RO4003C + RF4-370HR Mixed Dielectric Controlled Impedance Board
This PCB is a 10-layer mixed-dielectric multilayer circuit board adopting composite stacking of RO4003C ceramic hydrocarbon laminate and RF4-370HR high-Tg FR4 material. It features asymmetric mixed copper foils with 1oz outer copper and 1oz/0.5oz inner copper, with a finished lamination thickness of 1.618mm. Fitted with double-sided blue solder mask and white silkscreen, the board applies enhanced immersion gold treatment (135%-150% gold thickness). Equipped with precise