Multi Layer PCB

1.6mm FR4 TG135 TG150 TG170 Multilayer Printed Circuit Board with Peelable Mask PCBA Capacity Single and double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.008 in. (0.2 mm) Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in. Assembly surface mount connectors Yes Odd form parts: Yes, Assembly by

Product Description Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 士0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper Thickness 18um--350um Drilling Hole (Mechanical) 17um--175um Finish Hole (Mechanical) 0.10mm

17um LPI Red 94V0 Multi Layer PCB Printed Circuit Board ISO14001 Abis Circuits Co., Ltd is a professional PCB manufacturer in China, Shenzhen. With 14 years+ development, we could make the PCB from 1L to 20L, with a monthly production capability of 60,000 square meters. Abis Circuits is providing high-quality bare PCB and PCB assembly service, including components sourcing, function test, conformal coating, and complete assembly for clients all over the world, Our main market

Immersion Gold 3u' Printed Circuit Board from Prototyping to Volume Production Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 士0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper Thickness 18um--350um Drilling Hole (Mechanical) 17um--175um Finish Hole (Mechanical) 0.10mm--6.30mm

2.0mm Enig3u' FR4 Multilayer Printed Circuit Board with Green Mask Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 士0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper Thickness 18um--350um Drilling Hole (Mechanical) 17um--175um Finish Hole (Mechanical) 0.10mm--6.30mm Diameter Tolerance

50u' Hard Gold Multilayer PCB Board Green Solder mask 1oz Copper Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 士0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper Thickness 18um--350um Drilling Hole (Mechanical) 17um--175um Finish Hole (Mechanical) 0.10mm--6.30mm Diameter

Printed Circuit Board Multi Layer PCB with FR4 Aluminum CEM1 Abis Circuits Co., Ltd is a professional PCB manufacturer in China, Shenzhen. With 14 years+ development, we could make the PCB from 1L to 20L, with a monthly production capability of 60,000 square meters. Abis Circuits is providing high-quality bare PCB and PCB assembly service, including components sourcing, function test, conformal coating, and complete assembly for clients all over the world, Our main market is

Abis Circuits Co. Ltd, established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters. Now we have passed ISO9001, ISO14001, UL, etc., With constant hard work of our staff and ongoing support from customers both home and abroad, we can provide up to 20 layers, Blind and buried Board, Our perfect management, advanced equipment, and

IPC Class 3 Gloss Blue FR4 High TG170 TG180 Multilayer PCB Board Abis Circuits Co. Ltd, established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters. Our products are mostly used in the field of Industrial Control, Telecommunication, Automotive products, Medical, Consumer, Security, and others. We have two factories together, the factory in Shenzhen is specialized in small and middle volume orders and the

Gold Plating 30u' Multi layer PCB HDI Printed Circuit Board for Module ABIS passed ISO9001, ISO14001, UL, etc., With constant hard work of our staff and ongoing support from customers both home and abroad, we can provide up to 20 layers, Blind and buried Board, high-precision(Rogers), High TG, Alu-base and flexible boards to our customer with fast turn and high-quality level. 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw

Items Speci. Remark Max panel size 47" x 22"(1200mm x 560mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.16mm 4-layer 0.4mm 6-layer 0.8mm 8-layer 1.0mm 10-layer 1.2~2.0mm Min. line Width/Space 0.1mm(4mil) Max. Copper thickness 10OZ Min. S/M Pitch 0.1mm(4mil) Min. hole size 0.3mm(12mil) Hole dia. Tolerance (PTH) ±0.05mm(2mil) Hole dia. Tolerance ,+0/-0.05mm(2mil) Hole position deviation ±0

Capacity: Raw material FR-4, High TG FR-4,PTFE, Aluminum Base,Cu base. Rogers,etc Board Thickness 0.20mm--8.00mm Layer 1 Layer-20 Layer Insulation Layer Thickness 0.075mm--5.00mm Min.hole size 0.1mm (drilling hole) Max. Board size 1200mm*600mm Out Layer Copper Thickness 18um--350um Inner Layer Copper Thickness 17um--175um NPTH Hole Tolerance +/- 0.075mm PTH hole Tolerance +/-0.05mm Outline tolerance +/-0

Multi Layer PCB Prototype Multi Layer Fr4 PCB Assembly with Customized PCB Service PCBA Capabilities 1 SMT assembly including BGA assembly 2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Component height: 0.2-25mm 4 Min packing: 0204 5 Min distance among BGA : 0.25-2.0mm 6 Min BGA size: 0.1-0.63mm 7 Min QFP space: 0.35mm 8 Min assembly size: (X*Y): 50*30mm 9 Max assembly size: (X*Y): 350*550mm 10 Pick-placement precision: ±0.01mm 11 Placement capability: 0805, 0603, 0402 12

Product Details: 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask, 4. Printed Circuit Boards adhere to IPC Class 2 & 3 international PCB standard. 5. Quantities range from prototype to medium&big batch production. 6.100% E-Test

ITEQ 180 Multilayer PCB TV Box Printed Circuits Board with IPC Class 2 Abis Circuits Co. Ltd, established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters. Our products are mostly used in the field of Industrial Control, Telecommunication, Automotive products, Medical, Consumer, Security, and others. Now we have passed ISO9001, ISO14001, UL, etc., With constant hard work of our staff and ongoing support from

Embedded System 2U' Immersion Gold 4 Layer PCB with Blind Hole Gold Finger Abis Circuits Co. Ltd, established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters. 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask, 4. Printed Circuit

Multi Layer PCB copper 4 layer pcb board 6 layers pcb for Medical Device Rigid PCB Production Capacity SERIAL ITEM TECHNICAL DATA 1 Types of Products HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,Teflon Board, and HDI 2 Layers 2-32(layers) 3 Max Board Size 1200x560mm 47" x 22" 4 Min Board Thickness 4(layers)0.40mm 16mil 6(layers)0.80mm 32mil 8(layers)1.00mm 40mil 10(layers)1.20mm 48mil 5 Copper Clad(Max.) 20 oz(outer)/4

Multi Layer PCB bare pcb printed circuit plac circuit design Immersion Gold PCB Layer 1-20 layers Material FR-4,CEM-1,Aluminum base,Copper base,FR-1,CEM-3,High TG,FR4 Halogen Free, Rogers, TEFLON etc. Board thickness 0.2mm-6mm(normally 1.6mm) Max. board size 1200*600mm Finished board thickness 0.3-5mm Min .drilled hole size 0.1mm Min. line width 0.1mm(4mil) Min. line space 0.1mm(4mil) Surface finish/treatment HASL, lead free HASL ,Immersion Gold(ENIG),Immersion Tin ,Immersion

Technical & Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4(High TG),Aluminum Base,Cu base,CEM1,CEM3,Polyimide,Halogen free,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance +0.10mm Thickness Tolerance(t≥0.8mm) ±8% Thickness Tolerance(t

Multi Layer PCB Immersion Gold Rigid, Flexible, Mobile Phone Circuit Board Capacity: -PCBA Capacity Single and double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.008 in. (0.2 mm) Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in. Assembly surface mount connectors Yes Odd form parts: Yes, Assembly