Photography Light LED Chip
Dimmable COB LED Chip Special For Photography Lamps 3856 300W 500W 2700k 3000k 4000k 5000k 6000k 6500k 36V 39V OEM/ODM
COBE POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 3856 SERIES 300W Five-color COB 620nm/460nm/520nm/2700K /6500K 100-110LM/W 1.5A 36-39V 38*56 32MM 120° 95 Copper + aluminum nitride1.6T 500W Five-color COB 620nm/460nm/520nm/2700K /6500K 100-110LM/W 2.7A 36-39V 38*56 32MM 120° 95 Copper + aluminum nitride1.6T Differences between COB chips and traditional chips Packaging form: COB chips are directly exposed on the circuit board, while traditional chips are
300W 500W COB 3856 Led Chip CCT Five Color 2700k- 6500k Customizable LED 36-39V OEM /ODM COB for Photography Video Light
3856 Cob Led Chip Rgbww 300w 500w 36v 39v Cri95 For Photography Lights Stage Lights 3856 COB LED CHIP Product parameters COBE POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 3856 SERIES 300W Five-color COB 620nm/460nm/520nm/2700K /6500K 100-110LM/W 1.5A 36-39V 38*56 32MM 120° 95 Copper + aluminum nitride1.6T 500W Five-color COB 620nm/460nm/520nm/2700K /6500K 100-110LM/W 2.7A 36-39V 38*56 32MM 120° 95 Copper + aluminum nitride1.6T Differences between COB
3856 SIZE Movie Lights Stage Lights 300W COB Chip CRI95 500W 2700K 6500K RGBCW RGBWW Dimmable CCT COB LED Factory OEM ODM
3856 Cob Led Chip Rgbww 300w 500w 36v 39v Cri95 For Photography Lights Stage Lights 3856 COB LED CHIP Product parameters COBE POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 3856 SERIES 300W Five-color COB 620nm/460nm/520nm/2700K /6500K 100-110LM/W 1.5A 36-39V 38*56 32MM 120° 95 Copper + aluminum nitride1.6T 500W Five-color COB 620nm/460nm/520nm/2700K /6500K 100-110LM/W 2.7A 36-39V 38*56 32MM 120° 95 Copper + aluminum nitride1.6T Differences between COB
High Power Lamp Beads Led Chips COB RGB CCT 100W 200W COB LED RGB RGBW RGBCW LED Chip
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Double Smd Led Epistar Chip 4055 Bi-color Red White Color With CCT 2700K/6500K
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
100W 200W 300W 4055 Bi Color High Power COB LED Chip 42-75V 2700K 5600K 6500K CRI 95 IF 2.7A Ra90 Ra95
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
300w 5600k Led Chip with High LM/W 90/120 Efficiency and Customize CCT 1800K 2000K 3000K 4000K 5000K 6000K
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Power LED Chip 4055 LED 100W Chip Dual CCT 200W 200W Bi Color 2700K 6500K LED COB 45V for Photography Video Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
1200W 70V-100V Ra95 2700-6500K 18-21A*2 120x100mm LED Light Cob Led 1200w 2400w
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Power 1200W CRI>95 6500K Copper Board Good Heat Dissipation Led Cob Chip Used in Photography Light/ Video Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
1000-1200W White TC 2700K/6500K 70-100V Ra95 Led Cob Lighting Source for Photography Lights
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
2400W COB Bi-Color 2700K 6500K CCT High Power 1200W+1200W COB 120mm*100mm LED Chip Module CRI 95+ for Photography Lighting
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
1200W+1200W Bi-Color COB 2700K 6500K CCT High Power 1200W+1200W COB 120mm*100mm LED Chip Module Ra95+ for Photography Lights
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Factory Price 5050 42-46V 300W+300W 700W+700W Five Color COB LED Chip High Power COB CRI95 LED COB Chip for Photography Lights
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Professional Customized COB 300w 500w 700w Cob led Chip Five-color integrated COB lamp beads
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Constant Voltage 42V-46V Five Color COB LED Chips 2700K+6500K High Power 300W 700W COB LED 5050
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Round 36mm High Power 300W 700W RGBW RGBWW Magic 5 in 1 Color Smart COB LED Chips R50 50*50 High Brightness CRI95+ 110LM/W Leds
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
200W CCT Star Shape Bi-color R61 60X60MM Emit Size 34MM Led Cob Chip on Board 130lm BiColor Flip Chip PCB for Stage Spotlight
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Factory Outlet COB LED Chip 3538 Five Color COB LED Chips 250W-350W 90-140lm/w 35*38MM LED Photograph Light With Fast Shipments
Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 3538 SERIES 250W/350W Five colors COB 620nm/460nm/520nm/2700K /6500K 90 2A*5 24-26V 35X38MM 26MM 120° 95 Boss thermal and electrical separation copper substrate + aluminum nitride structure COB (Chip on Board) LED is an LED packaging technology that directly connects LED chips to the PCB substrate instead of using traditional LED packaging. The advantages of five-color COB LEDs mainly include: High
COB 2424 40W Warm/Cold /Neutral White Color 2800K to 6500K OEM 36v-38v 110lm/w RA95 COB Module for Lamp
Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 2424SERIES 40W+40W Bi Color LED Chip 2800K/6500K 100/110 1100MA 36V-38V 24X24MM 21MM 120 95 Mirror copper-aluminum combined substrate Two-color COB (Chip-on-Board) LED lamps have many advantages, including: Energy-saving and efficient: The dual-color COB LED lamps adopt advanced LED technology, with high light efficiency and low energy consumption, which can save energy costs. Excellent light performance