Semiconductor Wafer Chip
Wafer Scrap Semiconductor Chips 4mm x6mm 7mmx 11mm 6mmx 7mm
This is the leftover material after Jin Yuan is cut, and the wafer can also be taken out. Each chip can take about 130 wafers, and the box is sent by air in a box of three kilograms. It can also be shipped in domestic ports. If necessary, please contact us. Taiwan channel direct hair. This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers can be removed for uncut material and defective products.
Semiconductor Chip Tray Semiconductor Smart Wafer Chip 5NANO 12”
This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers can be removed for uncut material and defective products. Market uses are as follows: 5nm wafer 5NANO technology wafer component chip applications cover: 5nm wafer 5NANO technology wafer component chip applications cover: ❶ Smartphone. ❷AI machine system high-speed operation. ❸Connect with high-end multi-party platforms such as the Internet of
5nm 12" Wafer Scrap Semiconductor Laser Chip 4x6m/M 6x7m/M 7x11m/M
This is the leftover material after Jin Yuan is cut, and the wafer can also be taken out. Each chip can take about 130 wafers, and the box is sent by air in a box of three kilograms. It can also be shipped in domestic ports. If necessary, please contact us. Taiwan channel direct hair. This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers can be removed for uncut material and defective products.
Semiconductor Quantum Chip nspection Semiconductor Chip Program
This is the leftover material after Jin Yuan is cut, and the wafer can also be taken out. Each chip can take about 130 wafers, and the box is sent by air in a box of three kilograms. It can also be shipped in domestic ports. If necessary, please contact us. Taiwan channel direct hair. This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers can be removed for uncut material and defective products.