PCB Printed Circuit Board

8-Layer High Precision FR-4 Multilayer Printed Circuit Board The 8-Layer High Precision FR-4 Multilayer Printed Circuit Board is a high-rise circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. this type of circuit board is made of shengyi S1000-2M material through mechanical drilling, surface gold deposition and other processes. The minimum aperture can reach 0.25mm and the minimum linewidth line spacing can reach 75 / 75um. It is mainly used in

10 Layer FR-4 Multilayer Board The 10 layer FR-4 multi-layer board is a high-rise circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. this type of circuit board is made of Taiyao tu872slk material through mechanical drilling, surface gold deposition and other processes. The minimum aperture can reach 0.25mm and the minimum linewidth line spacing can reach 75 / 75um. It is mainly used in communication phase-shifting HLC Process capability Item HLC

Automation System Application Board FR-4 High-Rise Board The automation system application board FR-4 high-rise PCB is a high-rise PCB developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made of Taiyao tu872slk material and surface gold deposition process. The circuit board is widely used in aerospace field HLC Process capability Item HLC Advanced Technology 2019 2020 2021 Max Panel Width (inch) 25 25 25 Max Panel Length (inch) 29 29 29 Max Layer Count (L)

FR-4 8-Layer Multilayer PCB FR-4 8-layer Multilayer PCB is a multilayer circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. this type of circuit board is made of s1000-2m material through mechanical drilling, surface gold deposition and other processes. The minimum aperture can reach 0.25mm, and the minimum line width and line distance can reach 75 / 75um. HLC Process capability Item HLC Advanced Technology 2019 2020 2021 Max Panel Width (inch) 25

16 Layer Semiconductor Test Board FR-4 Multilayer PCB The 16 layer semiconductor test board FR-4 Multilayer PCB is a multilayer circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. this type of circuit board is made of Shengyi s1000-2m material through mechanical drilling, surface gold deposition and other processes. The minimum aperture can reach 0.25mm, and the minimum line width and line distance can reach 75 / 75um. HLC Process capability Item

24 Layer High Density High Speed PCB Circuit Board The 24 layer PCB circuit board is one of a series of high-rise circuit boards developed and produced by Shenzhen Quanhong Electronics Co., Ltd. this type of circuit board is made of Taiyao tu872slk material through mechanical drilling, surface gold deposition and other processes. The minimum aperture can reach 0.25mm, and the minimum line width and line distance can reach 75 / 75um. HLC Process capability Item HLC Advanced

22 Layer Multilayer Printed Circuit Board The 22 layer multilayer printed circuit board is a multilayer PCB developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made of TUC(Taiyao) tu883 material and processes such as twice laser, twice pressing and surface gold deposition. This type of high-rise circuit board is widely used in military industry. HLC Process capability Item HLC Advanced Technology 2019 2020 2021 Max Panel Width (inch) 25 25 25 Max Panel

3-Stage 18 Layer Buried Blind Hole PCB Circuit Board The 3-stage 18 layer buried blind hole PCB is one of a series of high-level PCB boards developed and produced by Shenzhen Quanhong Electronics Co., Ltd., which is mainly used in the field of chip testing. HLC Process capability Item HLC Advanced Technology 2019 2020 2021 Max Panel Width (inch) 25 25 25 Max Panel Length (inch) 29 29 29 Max Layer Count (L) 16 18 36 Max Board thickness (mm) 3.2 4 6 Max Board thickness

16 Layer Ultra Small Spacing High-Rise PCB Circuit Board Ultra small spacing 16L high-rise PCB circuit board is one of a series of high-rise PCB boards developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made of Shengyi s1000-2m material, surface gold deposition and other processes. The PCB is widely used in artificial intelligence, 5g network and other fields HLC Process capability Item HLC Advanced Technology 2019 2020 2021 Max Panel Width (inch) 25 25

FR-4 4 Layer Security Product PCB Manufacture The FR-4 4 Layer Security Product PCB Manufacture is the rigidity PCB circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. the HDI board is made of FR-4 material, surface gold deposition and laser drilling. The minimum line width and line spacing can reach 75um and the minimum hole diameter can reach 0.1mm. The buried blind hole circuit board is widely used in digital cameras, notebooks, mobile phones

FR-4 4 Layer Green Soldermask Multilayer Board PCB Rigid PCB Manufacturing Capability Rigid PCB Manufacturing Capability Item PCB HDI Layer 1-40 1-40 Minimum linewidth/linespacing 3MIL/3MIL(0.075mm) 2MIL/2MIL(0.05MM) Minimum hole diameter 6MIL(0.15MM) 6MIL(0.15MM) Minimum solder resist opening (single-side) 1.5MIL(0.0375MM) 1.2MIL(0.03MM) Minimum solder resist bridge 3MIL(0.075MM) 2.2MIL(0.055MM) Maximum aspect Ratio (thickness/hole diameter) 10:01 8:01 Impedance control