Semiconductor Molding Machine

Automatic Molding Machine Performance Parameters ● Mold closing pressure: 98-1764kN; ● Injection pressure: 4.9-30kN adjustable; ● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm; ● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm). FAQ: Q: What is the brand name of this product? A: The brand name of this product is TJIN. Q: What is the model number of this product? A: The model number of this

Automatic Encapsulation System Product Details: ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansion of up to 4 groups of presses to realize high UPH; ● Equipped with vision system to recognize the feeding direction; ● WIN10 + 15 inch touch screen + touch keyboard; ● CCD image detection, feeding anti-reverse detection; ● Optional mold vacuum function, isolation mold function, detection function after plastic sealing; Product Description

Chip Molding Equipment Features: ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm; ● High efficiency cake loading component, aluminum box loading; ● Automatic cassette loading, double cassette stacked

Performance Parameters: ● Mold closing pressure: 98-1764kN; ● Injection pressure: 4.9-30kN adjustable; ● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm; ● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm). ● Supports flexible expansion of up to 4 groups of presses to realize high UPH; ● Equipped with vision system to recognize the feeding direction; ● WIN10 + 15 inch touch screen + touch

Auto Molding System in Semiconductor Features: ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake loading component, aluminum box loading; ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansion of up to 4 groups of presses to realize high UPH; ● Equipped with vision system to recognize the feeding direction; Technical Parameters: Type Vertical Injection Molding

Plasticizing Press Product Description: Semiconductor Molding Machine - Product Overview The Semiconductor Molding Machine is a state-of-the-art piece of equipment designed for high precision molding of semiconductor components. With a capacity of 100 tons, this machine is capable of handling large scale production while maintaining the highest level of quality. Product Specifications: Capacity: 100 Tons Injection Unit: Single Screw Diameter: 35 Mm Platen Size: 600 X 600 Mm

Auto Semiconductor Transfer Molding Taijin Semiconductor specializes in the research, development and production of semiconductor packaging equipment and chip packaging equipment: including automatic plastic sealing system, intelligent automatic rib cutting and molding separation system, rib cutting and molding equipment, automatic plastic sealing press, automatic chip arranging machine, flushing runner residual adhesive machine, etc., not only to customize a single piece of