Guangdong Taijin Semiconductor Technology Co., Ltd
                                                                                                           
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2024-04-16
Semiconductor Mold and Packaging Equipment Semiconductor Mold and Packaging Equipment
Discover the 120 Tons Auto Molding System with 12KW Heating Power from Guangdong Taijin Semiconductor Technology Co., Ltd. This advanced system offers precise clamping and injection pressures, adaptable to various lead frame and substrate sizes. Equipped with a PLC control system, CCD image detection, and optional mold vacuum features, it ensures high efficiency and reliability in semiconductor manufacturing.