Semi Automatic BGA Rework Station

Product Description: Operating at a voltage of 110/220V, the Semi Automatic BGA Rework Station has an overall dimension of L650×W630×H850mm. It is designed to provide accurate and efficient repairs, making it a must-have for any electronics repair workshop. The Semi Automatic BGA Rework Station is specifically designed for BGA chip repair, making it the perfect choice for professionals looking for an all-in-one solution for their electronics repair needs. The heater power of

Product Description: The WDS620 is capable of handling a wide range of chip sizes, with the applicable chips ranging from max 70*70mm to min 1*1mm. The locating way of the WDS620 features V shape slot and PCB support jigs that can adjust, with a laser light that allows for fast centering and positioning. This makes it easy to work with a variety of different chips and PCBs, with fast and reliable results every time. The power supply for the WDS620 is AC 220V±10% 50/60Hz,

Product Description: With its applicability to a range of chip sizes, from a minimum of 1*1mm to a maximum of 70*70mm, this BGA rework station is versatile and efficient. The vacuum nozzle ensures precise and accurate placement of the chip for optimal results. The vacuum pick feature of the BGA rework station allows for easy and safe handling of the delicate chips, preventing any damage or mishandling during the repair process. This makes it a valuable asset to any industry

Product Description: The Semi Automatic BGA Rework Station also features a semi-automatic placement mode, allowing for efficient and effective repairs. The device is equipped with an optical alignment system, which ensures that the BGA component is perfectly aligned with the PCB, reducing the risk of damage or errors. The Infrared preheating table is another standout feature of this device. It allows for precise and controlled heating of the PCB, which is essential for

Product Description: The Semi Automatic BGA Rework Station is equipped with a state-of-the-art optical alignment system that ensures accurate placement of BGA components on the PCB. The placement accuracy of this rework station is ±0.01mm, which is an impressive feat, allowing for precise placement of BGA components, minimizing the risk of errors. This rework station operates on a power supply of 220V/110V, making it suitable for use in a variety of settings. The heating

Product Description: What sets this BGA rework station apart is its semi-automatic placement mode, which allows for greater precision and accuracy during repairs. The heating method used in this BGA rework station is a combination of infrared and hot air, which ensures that the device being repaired is heated evenly and accurately. The BGA rework station also features three heating zones, which can be controlled independently. This enables the repair technician to apply the

WDS-1800 BGA rework machine offers infrared+gas hybrid heating for fast, precise repairs. Features automated functionality, mark point recognition, and supports all major package types. Includes 1-year warranty, test reports, and 220V operation for industrial PCBA repair.

WDS-580 Touch Screen High Quality Soldering Station Motherboard Repair Mobile Repair Tools New Product Specifications TypeSoldering Station Place of OriginChina ConditionNew Input Voltage220V Maximum TemperatureOTHER Power SourcePlug Powered Brand NameZhuomao DimensionsL635xW620xH655mm UsageWelding Warranty1 Year Weight60 kg Key Features Expertise in Repairing High-quality Motherboards: Specifically designed for motherboard repair with two-year warranty for lasting performanc

Highlight: High Precision BGA Reballing Machine, WDS 620 BGA Reballing Machine, AC 220V BGA Soldering Machine Power Supply: AC 220V±10% 50/60Hz Total Power: 5300W Upper Heater Power: Max 1200W Down Heater Power: Max 1200W IR Heater Power: Max 2700 High Precision BGA Reballing Machine WDS 620 AC 220V with 5200W Power Semi Automatic Optical Alignment BGA Rework Station WDS-620 Parameter Specification 1 Power supply AC 110V/220V±10％ 50/60Hz 2 Total power Max 5300W 3 Heater power

Highlight: High Precision BGA Reballing Machine, WDS 620 BGA Reballing Machine, AC 220V BGA Soldering Machine Power Supply: AC 220V±10% 50/60Hz Total Power: 5300W Upper Heater Power: Max 1200W Down Heater Power: Max 1200W IR Heater Power: Max 2700 High Precision BGA Reballing Machine WDS 620 AC 220V with 5200W Power Semi Automatic Optical Alignment BGA Rework Station WDS-620 Parameter Specification 1 Power supply AC 110V/220V±10％ 50/60Hz 2 Total power Max 5300W 3 Heater power

Hot Air Infrared Combo BGA Rework Station WDS620 High Precision BGA Reballing Machine - WDS 620 BGA Reballing Machine, AC 220V BGA Soldering Machine Technical Specifications Power Supply AC 220V±10% 50/60Hz Total Power 5200W Upper Heater Power Max 1200W Lower Heater Power Max 1200W IR Heater Power Max 2700W Detailed Parameter Specification Power Supply AC 110V/220V±10% 50/60Hz Total Power Max 5300W Heater Power Distribution Upper zone: 1200W, Second zone: 1200W, IR zone:

Semi Automatic Optical Alignment BGA Rework Station WDS-620 Parameter Specification 1 Power supply AC 110V/220V±10％ 50/60Hz 2 Total power Max 5300W 3 Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W 4 Electrical material Driving motor+PLC smart temp.controller+color touch screen 5 Temperature controlling (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃ 6 Locating way V shape slot,PCB support jigs can

WDS-620 Optical Alignment BGA Rework Station Parameter Specification 1 Power supply AC 110V/220V±10％ 50/60Hz 2 Total power Max 5300W 3 Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W 4 Electrical material Driving motor+PLC smart temp.controller+color touch screen 5 Temperature controlling (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃ 6 Locating way V shape slot,PCB support jigs can adjust,laser

Semi Automatic Optical Alignment BGA Rework Station WDS-620 Parameter Specification 1 Power supply AC 110V/220V±10％ 50/60Hz 2 Total power Max 5300W 3 Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W 4 Electrical material Driving motor+PLC smart temp.controller+color touch screen 5 Temperature controlling (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃ 6 Locating way V shape slot,PCB support jigs can

Semi Automatic Optical Alignment BGA Rework Station WDS-620 Parameter Specification 1 Power supply AC 110V/220V±10％ 50/60Hz 2 Total power Max 5300W 3 Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W 4 Electrical material Driving motor+PLC smart temp.controller+color touch screen 5 Temperature controlling (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃ 6 Locating way V shape slot,PCB support jigs can

Product Description: The Semi Automatic Placement Mode streamlines the process for optimal performance. The user-friendly interface enables easy operation, making it a perfect tool for use in both small and large-scale electronic manufacturing plants. The product name, Advanced Technology Semi Automatic BGA Rework Station for Electronics Industry, speaks to the device's ability to handle the most challenging tasks with ease. It is a reliable product that is designed to meet

Make PCB positioning folding welding Full Automatic BGA Rework Sation WDS-800 Specification Max PCB Size W650*D610mm PCB Thickness 0.5-8mm BGA Size 1*1-80*80mm Min.ball pitch 0.15mm Max Weight of BGA 150g Placement precision ±0.01mm PCB Locating Way Outer or location hole Temperature Control K-type thermocouple,close loop control Lower Heating Power Hot air 1200W Upper Heating Power Hot air 1200W Bottom pre-heating IR5000W Power Supply (Double Phase)220V,50/60Hz Machine

WDS-800 Full Automatic machine Optical Alignment apparatus BGA repair Robot Specification Max PCB Size W650*D610mm PCB Thickness 0.5-8mm BGA Size 1*1-80*80mm Min.ball pitch 0.15mm Max Weight of BGA 150g Placement precision ±0.01mm PCB Locating Way Outer or location hole Temperature Control K-type thermocouple,close loop control Lower Heating Power Hot air 1200W Upper Heating Power Hot air 1200W Bottom pre-heating IR5000W Power Supply (Double Phase)220V,50/60Hz Machine

Product Description: The BGA rework station is designed to handle PCB sizes of up to 470x380mm. The large working area is perfect for repairing a wide range of electronic devices, including laptops, gaming consoles, and smartphones. The station is equipped with a powerful 5200W heating system that delivers consistent and even heat to the working area, ensuring that your rework tasks are completed efficiently and effectively. The BGA rework station is compatible with both 220V

Semi Automatic BGA chip rework station WDS-650 Technology parameter 1 Power supply AC 110V/220V±10％ 50/60Hz 2 Total power Max 6400W 3 Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 4000W 4 Locating way V shape slot,PCB support jigs can adjust,laser light do fast centering and position 5 Temperature controlling (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃ 6 Electrical material Driving motor+ smart temp