Semi Automatic BGA Rework Station

Highlight: High Precision BGA Reballing Machine, WDS 620 BGA Reballing Machine, AC 220V BGA Soldering Machine Power Supply: AC 220V±10% 50/60Hz Total Power: 5300W Upper Heater Power: Max 1200W Down Heater Power: Max 1200W IR Heater Power: Max 2700 High Precision BGA Reballing Machine WDS 620 AC 220V with 5200W Power Semi Automatic Optical Alignment BGA Rework Station WDS-620 Parameter Specification 1 Power supply AC 110V/220V±10％ 50/60Hz 2 Total power Max 5300W 3 Heater power

WDS-900: Fully automated BGA rework station with 9000W power, 5 temperature sensors, and 0.01mm precision. Handles PCBs up to 750x620mm. 3-year warranty, OEM support, and factory-direct quality for 5G serverboard repair.

WDS-650 BGA Rework Station: High-precision IR heating system with triple-zone heating, HD optical alignment, and touch-screen control. CE certified with ±0.01mm accuracy for automotive ECU, motherboard, and industrial board repair. 1-year warranty.

Product Description: The Semi Automatic BGA Rework Station is a state-of-the-art solution designed for precision and efficiency in the repair and rework of Ball Grid Array (BGA) components. Engineered to meet the demands of modern electronic manufacturing and repair environments, this rework station combines advanced technology with user-friendly features to ensure optimal performance and reliability. One of the standout features of this rework station is its advanced optical

Hot Air Infrared Combo BGA Rework Station WDS620 High Precision BGA Reballing Machine - WDS 620 BGA Reballing Machine, AC 220V BGA Soldering Machine Technical Specifications Power Supply AC 220V±10% 50/60Hz Total Power 5200W Upper Heater Power Max 1200W Lower Heater Power Max 1200W IR Heater Power Max 2700W Detailed Parameter Specification Power Supply AC 110V/220V±10% 50/60Hz Total Power Max 5300W Heater Power Distribution Upper zone: 1200W, Second zone: 1200W, IR zone:

High precision LED module repair machine WDS-620 with laser position HDD camera How about Wisdomshow manufacturer ? 1. R&D Capacity: 10 years of professional manufacturering experience. 2. Quality Control Management : All productiong lines have adequate quality control and QA/QC inspectors work independently from the production line, All products passed CE & ISO certification. 3. After- Service : Prefect After Sales service, foreign trading employees 24hours/7days . Product

Professional WDS-620 BGA Rework Station with ±0.01mm precision alignment via HD CCD camera. Features triple-zone heating, MCGS touch screen control, and 99.99% success rate. Ideal for laptop, phone, and electronics repair. 1-year warranty included.

Fully automatic BGA rework station with 7600W IR heating, ±0.01mm precision alignment, and intelligent temperature control. Handles chips from 0.3×0.6mm to 90×90mm. Features HD camera alignment, 5 thermocouple ports, and 1-year warranty for reliable PCB repair.

WDS-1250 Auto CCD BGA Rework Station: Full automation for large motherboards up to 1200x900mm. Features HD optical alignment, ±0.01mm precision, 13 thermocouples, and 3-in-1 heating. 1-year warranty with PLC control for industrial PCB repair.

WDS-680 Automatic Optical BGA Rework Station Parameter Specification MODEL WDS-680 Power supply AC Ac220v±10%, 50/60Hz The power supply 7600W Upper hot air heating Max 1200W Lower hot air heating Max 1200W IR PREHEATER 5000W(2000W controlled) Suitable PCB size Max 610*480mm Min 10*10mm Applicable chip size Max 80*80mm Min 0.8*0.8mm Mounting precision 0.3-8mm Temperature measuring interface 3pcs Maximum mouting load 150G Overall dimensions L760*W800*H880 Machine weight 85KG

Semi Automatic BGA chip rework station WDS-650 Technology parameter 1 Power supply AC 110V/220V±10％ 50/60Hz 2 Total power Max 6400W 3 Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 4000W 4 Locating way V shape slot,PCB support jigs can adjust,laser light do fast centering and position 5 Temperature controlling (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃ 6 Electrical material Driving motor+ smart temp

Product Description: The Semi Automatic BGA Rework Station is a highly efficient and reliable solution designed for professionals engaged in motherboard repair and other advanced electronics servicing. This rework station is engineered to handle Ball Grid Array (BGA) components up to a maximum size of 80x80mm, making it suitable for a wide range of applications, from small-scale repairs to more complex motherboard refurbishment tasks. Its robust design and precise control

Wisdomshow S7 BGA Rework Station: High-resolution vision system with 8-segment temperature control, CE certification, and touch screen operation. Ideal for training labs and repair workshops. 1-year warranty, manual mode for soldering/desoldering chips.

WDS-750 BGA Rework Station: High-precision 3-in-1 system for BGA chip replacement. Features ±1°C temperature control, optical alignment, triple-zone heating, and CE certification. Ideal for electronics repair shops and manufacturing plants.

Product Description: The Semi Automatic BGA Rework Station is a highly efficient and reliable tool designed specifically for the precise repair and replacement of Ball Grid Array (BGA) components on printed circuit boards (PCBs). Engineered to meet the demanding needs of modern electronic repair and manufacturing, this rework station offers exceptional performance with a range of advanced features tailored for both professional technicians and production environments. With

WDS-620 BGA Rework Station features triple-zone heating, 5MP CCD optical alignment (±0.01mm precision), and PLC touch control. Industrial-grade thermal precision ensures 99.99% repair success for BGA chips on motherboards, laptops, and electronics. ISO9001 & CE certified with 1-year warranty.