Polyimide Film Clad With Copper Used In Flexible Circuit Settings

Discover the Ultra-Thin, High-Performance PI Films for Advanced Tech, perfect for flexible circuit settings. These polyimide films clad with copper offer exceptional thermal and electrical properties, ideal for adhesive substrates and chip packaging. Made in China with UL, ISO, and ROHS certifications, they come in customizable thicknesses and widths for versatile applications.