Plasma Etching

A quartz end effector for an etcher is a high-purity, robotically controlled tool, often a specialized blade or fork, made from quartz to precisely handle delicate semiconductor wafers during etching processes, designed with smooth surfaces and edge-contact features to prevent contamination and damage, ensuring thermal stability and chemical resistance in harsh plasma environments. Description Blade Quartz 300mm Specification 330.1×152.3×8.95T or customized Tolerance ±0.01mm

A quartz baffle plate is a precision-engineered component, usually made from ultra-pure fused quartz, used inside semiconductor processing chambers (like furnaces or plasma reactors) to control, direct, and uniformize the flow of reactive gases or plasma over silicon wafers during manufacturing, ensuring consistent, high-quality chip production by managing thermal gradients and preventing contamination. Description SOURCE SEPARATE PLATE 2, SH, C10 Specification Φ240×5T or

A quartz partition ring (or focus ring/edge ring) is a high-purity fused silica component used in wafer processing, especially etching, to guide process gases, confine plasma, protect the wafer edge, ensure uniform etching, and prevent contamination, benefiting from quartz's extreme purity, thermal stability, and chemical resistance in harsh semiconductor environments. Description PARTITION RING COMBO, SH, C10 Specification Φ157×Φ147×7.5T or customized Tolerance ±0.01mm

A semiconductor "ceiling support ring" isn't a standard term, but it likely refers to a specialized component in wafer processing, such as a Hot Edge Ring (HER) or Focus Ring, made from materials like Silicon Carbide (SiC) that sits around the wafer's edge in plasma chambers to control gas flow, temperature, and shield reactor walls, ensuring uniform deposition or etching, rather than a decorative fixture. Description CEILING SUPPORT RING, C08 Specification Φ192×Φ146×8.9T or

A semiconductor quartz insert ring is a high-purity, precision-engineered ring made from fused quartz, crucial in semiconductor etching to guide etching gases, control plasma, and shield wafers from contamination, ensuring uniform etching, reduced defects, and higher yields in chip manufacturing. Description INSERT RING, PROCESS KIT, QUARTZ, B13 Specification Φ237×Φ195.6×11.25T or customized Tolerance ±0.01mm Material GE, HSQ, PQ, FLH or other specified Surface Treatment

A quartz clamp ring is a specialized ring, often made of fused quartz or combined with polymers, used in semiconductor manufacturing (like with AMAT or LAM equipments) and high-temp lab settings to securely hold components like wafers, glass joints, or other parts during processing, sealing, or heating, offering chemical resistance and thermal stability where standard metal clamps can't. They are crucial for creating vacuum seals or supporting delicate parts in harsh

A quartz moving ring (or focus ring/shadow ring) in semiconductor etching guides reactive gases, confines the plasma to the wafer's surface for uniform etching, prevents contamination from chamber parts, protects the wafer edge, and manages plasma density/electric fields, all while withstanding high heat and corrosive plasma thanks to quartz's purity and stability. Description MOVING RING ID430 SLOT,QTZ Specification Φ570×Φ433×58.5T or customized Tolerance ±0.01mm Material GE

A quartz cover ring in semiconductor etching guides reaction gases for uniform etching, protects the wafer edge, prevents contamination by sealing the process area, and withstands high temperatures and corrosive plasma, ensuring precise patterning, high yield, and longer equipment life. Description HIGH PURITY COVER RING Specification Φ384.2×Φ317.6×13T or customized Tolerance ±0.01mm Material GE, PQ, FLH or other specified quartz (either natural or synthetic) Surface