Heat Sink Plates

Black Extruded Heat Sink CNC Machining CPU Server Application Cooling Product Overview High-performance thermal management solution designed for CPU and server applications, featuring advanced skiving fin technology for superior heat dissipation. Material AL 1100 Size 12×9.3×12.3cm Weight 0.718kg Technology Fins stamping Surface Treatment Oil cleared, cleaned and passivation Heat Conducting Power 65W Skiving Fin Technology Skiving fin technology involves precision machining

Custom Copper Thick Fin Skived Heat Sink High Power Thermal Solution Product Overview This custom copper thick fin skived heat sink delivers reliable performance with excellent thermal conductivity, specifically engineered for demanding thermal management applications. Material Copper 1020 Product Dimension 80×40×12mm Product Weight 0.18 kg Surface Treatment Passivation Heat Conducting Power 50W Product Technology Skiving + Passivation Skived Fin Heat Sink Technology Skiving

Copper High Density Fin Heat Sink Plates Liquid Cooling System Component Product Overview Liquid Cooling System Copper High-Density Fin Heat Sink Material: Copper 1020 Product Dimension: 70×70×9mm Product Weight: 0.089 kg Surface Treatment: Passivation Heat Conducting Power: 30W Product Technology: Skiving + Passivation Skiving Fin Heat Sink Technology Skiving fin technology involves precision machining of copper teeth to create specialized radiator profiles using advanced

Amplifier Aluminium Extrusion Skived Heatsink Heat Sink Power Cooling Product Overview High-performance aluminium heat sinks designed for efficient thermal management in demanding electronic applications. Material AL 1060 Size 50×50×70mm Technology Extruded + CNC Machined Surface Treatment Passivation Heat Conducting Power 40W Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules for fronthaul/mid-haul equipment of 5G base

40W Extrusion Profile Aluminum Heat Sink Industrial Application Cooling Product Overview Material AL 6061 Aluminum Dimensions 20 × 18 × 22 mm Manufacturing Technology Extruded + CNC Machined Surface Treatment Anodized Heat Conducting Power 40W Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules for fronthaul/mid-haul equipment of 5G base stations Low-power optical communication components for edge computing nodes Manufacturing

30W Aluminum Foil Extrusion Heat Sink Street Light Cold Forged Radiator 30W Light Street Aluminum Foil Extrusion Heat Sink. Advanced cold forged heat sink designed for optimal thermal management in demanding applications. Material: AL 6061Size: 8×8×5cmWeight: 0.187kgSurface Treatment: Black anodizedHeat Conducting Power: 30WKey FeaturesHigh cooling efficiency and energy-saving performanceCold forging process optimizes material microstructureHigh-purity aluminum (AL1050/AL1070

Anodized Aluminum Extrusion CPU Heat Sink Computer Processor Cooling Solution CPU Heatsink with anodized aluminum extrusion designed for superior thermal management in demanding computing applications. Product Specifications Material: Al 6063 Dimensions: 7.6 × 7.6 × 15.5 cm Weight: 0.358 kg Heat Conducting Power: 60 W Surface Treatment: Anodized Key Feature: High precision and fast production efficiency Extruded heat sinks offer excellent thermal performance and energy

30W Cylindrical Aluminum Heat Sink LED Lighting Fixtures Cooling Product Overview High-performance cylindrical aluminum heat sink designed specifically for LED lighting applications, offering excellent thermal management and energy efficiency. Material: Al 6063 Dimensions: 9×9×5 cm Weight: 0.358 kg Heat Conducting Power: 30W Surface Treatment: Passivation Feature: High Efficiency & Energy-Saving Extruded heat sinks provide superior thermal performance with excellent energy

Computer Motherboard Heat Sink Plates Aluminum Profile Skiving Liquid Cooling Product Overview Advanced aluminum profile skiving computer motherboard heat sink featuring anodized black finish and skived fin technology. This high-performance cooling solution utilizes innovative manufacturing processes for superior thermal management in computing applications. Technical Specifications Material Aluminum Product Dimension 58×58×30 mm Product Weight 0.35 kg Surface Treatment

Heat Pipe Heatsink Aluminum Base Computer Cooling Thermal Solution SizeCustom size ShapeSquare ProcessSoldering FinishChemical nickel plating InspectionCallipers, CMM, projector Extra ProcessStamping + CNC Machining MaterialHeat pipe + Aluminum zipper fin PackingPaper carton with wooden pallet ApplicationLaptop CPU, LED CertificateISO 9001:2008, ISO 14001:2004 Applied FieldAerospace, Computer CPU, Haulage motor, Solar energy, LED Product Overview Copper tubes are primarily

Custom Copper Thick Fin Skived Heat Sink Electronic Cooling Solution This custom copper thick fin skived heat sink delivers reliable performance and excellent thermal conductivity for demanding thermal management applications. Material: Copper 1020 Product Dimension: 80x40x12mm Product Weight: 0.18 kg Surface Treatment: Passivation Heat Conducting Power: 50W Product Technology: Skiving + Passivation Skived Fin Heat Sink Technology Skiving fin technology involves mechanically

Custom Copper 6 Heat Pipe CPU Cooler Professional cooling solution featuring six copper heat pipes for superior thermal management in demanding applications. Product Specifications Size Custom size Shape Square Process Soldering Material Aluminum zipper fin + heat pipe + Aluminum base Packing Carton and wooden pallet Application Laptop CPU, LED Certificate ISO 9001:2015, ISO 14001:2015 Extra Process Stamping + CNC Machining Copper Heat Pipe Advantages Copper tubes are widely

Copper Heat Pipe Heat Sink for New Energy Vehicle Cooling Thermal Management Advanced copper heat pipe heat sink solution designed specifically for thermal management in new energy vehicles and high-performance electronic applications. Product Specifications Specification Details Size Custom size Shape Square Finish Passivation Process Soldering, Stamping Extra Process CNC Machining Material Copper zipper fin + copper pipe + Copper base Packing Paper carton with wooden pallet

Heat Pipe Heat Sink Module Stamping Fin Thermal Solution Cooling Our heat pipe heat sink module with stamping fin combines advanced thermal management technology with precision manufacturing. The copper heat pipes (0.4-0.5mm diameter) provide exceptional heat transfer efficiency, while the aluminum zipper fins maximize surface area for optimal cooling performance. Product Specifications Size: Custom size Shape: Square Process: Soldering Material: Aluminum zipper fin + heat

400W Extrusion Welding Heat Sink Radiator Industrial Application Cooling 400W Aluminum Extrusion Welding Heat Sink Radiator High-performance copper and aluminum heat sink radiator designed for demanding thermal management applications with 400W heat conducting power. Material: Copper and Aluminum Heat Conducting Power: 400W Product Weight: 2.46kg Surface Treatment: Anodized Product Technology: Welding and Extrusion Dimensions: Customizable Copper tubes are primarily used in

Clip Type Zipper Fin Computer CPU Heat Sink 4 Heat Pipes Radiator Product Overview Clip-type Zipper Fin Computer CPU Heat Sink With 4 Heat Pipes. Advanced cooling solution designed for high-performance computing systems with innovative zipper fin technology and four heat pipes for superior thermal management. MaterialAluminum + Copper Dimensions122×88×72mm Weight0.56 kg Heat Conducting Power120W Surface TreatmentPassivation TechnologyZipper fin + surface finish CPU Zipper Fin

Copper Heat Pipe Heat Sink Medical Electronics Cooling Thermal Management Product Overview This advanced copper heat pipe heat sink delivers reliable thermal performance for critical medical electronic applications, ensuring optimal temperature control and device longevity. MaterialAluminum + Copper Dimensions158×109×36mm Weight0.365 kg Heat Conducting Power140W Surface TreatmentPassivation Product TechnologyStamping zipper fin + passivation CPU Zipper Fin Heat Sink