Application:

1 Rigid-Flexible PCB Assembly

2 Human Machine Interfaces

3 CPU Cards and Modules

4 Display Filters and Films

1.Electrical Specifications @25℃
   Type : Balance low pass 100Ω impedance
2.Insertion Loss
   1-50MHZ .................-0.5 dB Max
   50-125MHZ .............-1.0 dB Max
   125-300MHZ ...........-2.0 dB Max
3.Return Loss
   1-50MHz .................-20 dB Minload 100Ω
   50-200MHz .............-20+8*log(Freq MHz/50MHz) dB Min load 100Ω
   200-300MHz ...........-15+30*log(Freq MHz/200MHz) dB Min load 100Ω
4.Reflected CM to Diff Conversion (REF)
   1MHZ ......................-30 dB Min
   50MHZ ....................-30 dB Min
   100MHZ ..................-27 dB Min
   200MHZ ..................-24 dB Min
   300MHZ ..................-22 dB Min
5.CM to DM Conversion(REF)
   1-50MHZ ................-35 dB Min
   125MHZ .................-30 dB Min
   200MHZ .................-27 dB Min
   300MHZ .................-24 dB Min
6.Reflected Diff to CM Conversion (REF)
   1-10MHZ ................-48 dB Min
   10-300MHZ ............-48+19*log(Freq MHz/10MHz) dB Min
7.CM to CM Attenuation (REF)
   1-200MHZ ..............-25 dB Min
   200-300MHZ ..........-20 dB Min
8.Cross Talk (REF)
   1-125MHZ ..............-30 dB Min
   125-200MHZ ..........-25 dB Min
   200-300MHZ ..........-25 dB Min
9.Inductance

   @ 100KHz, 0.1V, 8mA DC BIAS 160uHMin
10.HiPot Test
   @ 1500 Vrms
11.Turns Ratio
   @ 1:1±5%