High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)
Price:
Negotiable
MOQ:
100pcs
Delivery Time:
Negotiable
Brand:
Uchi
Product Description
High-Density DIMM Liquid Cooling Radiator for Servers
Advanced cooling solution compatible with DDR5 and MRDIMM memory modules, designed for high-performance server applications.
Technical Specifications
- Structural Design: Modular cold plate with independent memory cooling fins (copper microchannels, fin density ≥ 8 fins/cm); supports narrow-pitch memory layouts (0.297-0.35 inches) and covers 8-16 memory sticks per plate
- Heat Dissipation Performance: ≥22W per memory stick, thermal resistance as low as 0.05℃*cm²/W; maintains memory temperature below 50℃ under full load with PG25 coolant
- Interface & Compatibility: UQD quick-connect fittings (leakage rate < 10⁻⁶ Pa*m³/s) with blind mating support (0.8mm error compensation); compatible with MRDIMM/DDR5 memory and 2U/4U server architectures
- Materials & Dimensions: Electrolytic copper + aluminum alloy construction (thermal conductivity ≥ 401 W/m*K); single module weight < 250g; compatible with standard server chassis dimensions
Application Fields
AI Data Centers - Compatible with GB300/NVL72 AI servers for large language model training and inference
High-Performance Computing - Heat dissipation for supercomputing, climate modeling, and genome sequencing
Cloud Computing Servers - 2U/4U high-density rack servers for virtualized and containerized environments
Cold Plate Radiator Design
We design internal flow channels based on customer power consumption data and heat distribution patterns to meet specific temperature and uniformity requirements while maintaining optimal fluid flow resistance. Our design process includes comprehensive simulation analysis with iterative parameter adjustments to achieve thermal and hydraulic performance targets.
Production Equipment
| Equipment Type | Quantity | Technical Parameters |
|---|---|---|
| Tunnel Brazing Furnace | 2 Units | Max Welding Dimension: 1000mm (W) × 250mm (H), length unlimited Max Welding Temperature: 950℃ Applicable Materials: Copper, Aluminum |
| Vacuum Brazing Furnace | 2 Units | Max Welding Dimension: 800mm × 1200mm × 800mm Max Welding Temperature: 1200℃ Applicable Materials: Copper, Aluminum, Stainless Steel |
| Helium Leak Detection Equipment | 2 Units | Max Testing Dimension: 2500mm × 750mm × 700mm Testing Pressure Range: 0-3MPa Testing Precision: 2g/year or ≤1×10⁻⁶ Pa*m³/s |
| Hydrostatic Testing Equipment | 2 Units | Max Testing Dimension: 2500mm × 1500mm × 1000mm Testing Pressure Range: 0-5MPa |
| Pneumatic Testing Equipment | 2 Units | Max Testing Dimension: Unlimited Testing Pressure Range: 0-5MPa Testing Precision: 1Pa |
Advanced Brazing Technology
Our vacuum brazing process joins aluminum plates using filler metal with lower melting points than the base material, creating extremely strong joints without residual corrosive flux. This high-end technology provides uniform heating, precise temperature control, eliminates post-cleaning requirements, and minimizes part distortion.
Liquid Cooling System Technology
High-power liquid cooling systems require heat sinks capable of rapid heat absorption. Leveraging the high specific heat capacity of liquids, our systems transfer large amounts of heat through liquid flow, capable of dissipating heat ranging from several hundred watts to over one kilowatt.
Liquid Cold Plate Varieties
- Buried-tube Liquid Cold Plate: Fabricated by grooving plates, burying and welding copper tubes inside, then hermetically sealing via welding. Ensures reliable liquid tightness, operational safety, and high flatness for excellent thermal contact
- Inserted-tube Liquid Cold Plate: Manufactured by embedding copper tubes onto aluminum plate surfaces using welding or bonding processes, with strict flatness control for minimal thermal resistance
- Channel-type Liquid Cold Plate: Internal flow channels formed on copper or aluminum substrates through drilling, extrusion, and precision machining, sealed via friction welding or high-temperature brazing
- Liquid Cooling Block: For high-power chip heat dissipation with internal flow channels created through skiving fin technology to maximize heat exchange surface area
Material-Specific Cooling Products
Copper-brazed Liquid Cooling Products: GB200 liquid cooling module, H20 liquid cooling module, optical module liquid cooling module, and other copper cold plates. Compatible with phosphor copper, silver-based, nickel-based and gold-based solders.
Aluminum-brazed Liquid Cooling Products: LTS siphon radiator, die-cast electronic control liquid cooling box, power supply stamped liquid cooling plate, motor electronic control liquid cooling plate, 6G-3DRVC radiator, and other brazed liquid cooling radiators.
Stainless Steel-brazed Liquid Cooling Products: Liquid cooling manifold, DIMM liquid cooling module, and other stainless steel liquid cooling manifolds.
Key Applications
Lasers and medical equipment
EV power battery pack cooling
Power electronics and motor drive devices
Microwave 5G transmission systems
Renewable energy systems
IGBT and Power Semi-Conductor Systems
Data centers and industrial power applications
Defense systems and avionics
Fuel cells and traction systems
Quality Assurance
We maintain rigorous quality standards with comprehensive testing equipment including:
- 1 Coordinate Measuring Machine
- 1 projector instrument
- 2 water high pressure testing machines
- 4 thermal resistance testing machines
- 2 liquid leakage testing machines
Customer Service
- Prompt response to all inquiries
- Competitive pricing with guaranteed quality
- Efficient production scheduling
- Optimal transportation solutions
- Comprehensive technical support
Frequently Asked Questions
- Are you a trading company or manufacturer? We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.
- Have you exported goods before and to which regions? 60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.
- How many employees do you have? Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.
- Can you provide samples if we agree with the design? Yes, we provide samples for confirmation before mass production, along with technical drawings if required.
- What packing methods do you use? Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.
- Do you provide technical support for product issues? All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Guangdong Uchi Electronics Co.,Ltd
Location
Room 810, Unit 2, Building 5, Huixing Commercial Center, Dongsheng Road No.1, Zhongshan Dong, Shilong Town Dongguan, GUANGDONG, 523326 CN
Contact Person
Anna