LiFong(HK) Industrial Co.,Limited
                                                                                                           
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25 Years
Since 2001
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Anodized Aluminum Semiconductor Cooling Plate ODM

Price Negotiable
Price: USD1/pcs
MOQ: 1000pcs
Delivery Time: 7-15days
Brand: LF
Product Description

Aluminum Heat Sinks Wide Water Cooling Head Plate CPU Semiconductor Cooling Sheet

 

 

 

Description:

 

Product name: water cooling head, water cooling plate.

 

Material thickness: primary color water cooling head GB 6063A, thickness of 11.5mm ±0.5Blue oxide water cooling head national standard 6063A, thickness 12MM±0.5Copper water cooling head contact surface pure copper, water nozzle brass, thickness of 9.5mm ±0.5 nozzle

 

Specification: aluminum water cooling head maximum diameter 9.5mm (suitable for the store 7-8mm inner diameter pipe)Maximum outer diameter of copper water cooling head is 8.5mm (suitable for the store's 7MM inner diameter water pipe)

 

Heat dissipation effect:Material comparison - copper thermal conductivity (401W/mk) is greater than 6063A aluminum thermal conductivity (201W/mk) copper heat dissipation effect is good.Channel Contrast - Finned channels are denser than M-shaped channels and carry away heat more easily.

Therefore, finned channels are superior to M-shaped channels

 

Process Friction Welding
Tolerance As per customer's requirements
Finish Polishing/Anodizing

 

 

Packing and delivery

 

Packaging Details

We have the package advantage:
1) The internal blister tray or pearl wool;
2) external carton packaging.

 

Delivery Time

1) Sample in 3 workdays after payment.

2) Mass production after payment 20 days.

 

 

Welcome to send us the detailed drawings.

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company LiFong(HK) Industrial Co.,Limited
Location Taixin Road,Wanjiang Town,Dongguan City,Guangdong Province,P.R.China
Contact Person Carl Peng

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