High Efficiency Desktop Selective Wave Soldering Machine YS-E320 For SMT Production Line
High Efficiency /High Quality Desktop selective wave soldering YS-E320 For SMT Production line
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Specification items |
YS-E320 |
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Applicable PCB board size |
L*W : 50×50～450×400 mm |
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Applicable PCB board thickness |
Substrate thickness:0.8～3 mm / Pin length:Within 3mm |
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Component height |
Less than 100mm above the substrate / Less than 50mm below the substrate |
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Substrate shape and conditions |
1.Substrate placement edge:The edge of the substrate process is more than 3mm 2The weight including components is less than 5 kilograms 3.The bending of the substrate: less than 0.5mm |
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Tin furnace |
Tin furnace material/capacity:Stainless steel material / 10KG tin tank capacity:Power:4*500W 2 KW |
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N2 Requirements |
Nitrogen purity:99.999% Pressure/Consumption:0.5MPa / 20ℓ/min～30ℓ/min / 1.2-1.5Cube H |
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Flux nozzle |
Precision fluid nozzle |
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Flux capacity |
2 L (Manual liquid addition) |
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Gas source |
0.5-0.7Mpa |
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Nozzle inner diameter |
φ 3mm~φ 20mm Customizable size |
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Peak height |
Automatic alignment/height measurement |
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System control |
PC+PLC(windows+Huichuan) |
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Programming software |
Support programming for drawing lines on pictures(Convenient and fast) |
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Power supply/power |
Single-phase 220V±10% Starting power:2.5KW |
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Weight |
70KG (Containing solder10KG) |
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External dimensions |
L*W*H 730×800×840 mm |
Preheat the top of the PCB board(Optional)
A 1KW infrared heating tube is adopted to preheat the PCB board before soldering,which meets the high temperature requirements of special components, reduces the thermal shock of components, activates the activity of flux, improves the tin penetration of component pins, and enhances the soldering quality.
Preheat the bottom of the PCB board
Preheating the bottom of the PCB board
Taking advantage of the fast heat conduction speed of infrared rays, the PCB board is preheated before soldering and maintained at the set frequency during soldering to prevent temperature drop of the PCB board during soldering.
It belongs to the design principle of "preheating + soldering" carried out simultaneously, whichimproves the soldering efficiency and the tin penetration rate of components, and reduces the thermal shock caused by the sudden heat of heat-sensitive components. The cleanliness ratio
of the PCB board after soldering is relatively high.
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