Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Price Negotiable
Price: $8,000 / set
MOQ: 1 set
Delivery Time: Negotiable
Brand: YUSH
Product Description
Pulse-Heated Soldering Machine for FPC to PCB Board
High-precision pulse heat welding equipment for board assembly with advanced thermode technology for reliable FPC to PCB bonding.
Model Specifications: YSPP-1A
  • Accurate tin press without dragging
  • Precise temperature control
  • Fine-pitch positioning capability
  • Digital program pressure control
FPC to PCB Pulse-Heated Soldering Machine YSPP-1A Close-up view of FPC to PCB soldering machine components
Advanced Features
  • Rotary table design enables extremely short cycle times with simultaneous loading/unloading during heat sealing
  • High quality heat seal application up to 0.25mm pitch
  • Pneumatic bonding head provides up to 3,900N force
  • Digital programmable pressure control with LCD display
  • Closed loop PID temperature control with visible LED display
  • Real-time pressure sensor triggered bonding cycle
  • Floating Thermode ensures consistent pressure and heat transfer along flexfoil to LCD and/or PCB
  • Precision product fixtures (2X) with easy exchange, micrometer alignment, and vacuum component fixation
  • Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
  • Full microprocessor logic control for reliable operation
Technical diagram of pulse-heated soldering machine components Control system interface and alignment features
Technical Parameters
Parameter Specification
Model YSPP-1A
Size 500mm × 750mm × 910mm
Work Air Pressure 0.5-0.7 MPA
Working Area 110mm × 150mm
Temperature Setup 0-400℃
Tolerance of Temperature +2℃
Time of Pressing 0-99s
Tolerance of Pressing 0.05 MPA
Pulse-heated soldering machine in operation Work area and fixture details of YSPP-1A machine
Technology Overview
Hot bar soldering is extremely effective for bonding dissimilar components and parts that are difficult to unite. This pulse bonding technology differs from traditional soldering by using thermode technology based on rapid reflow through pulse heating. The procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damaging the flex circuit. The system selectively solders parts by heating them to temperatures that melt adhesives or solder, which then re-solidify to form permanent, reliable bonds.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company YUSH Electronic Technology Co.,Ltd
Location Building H, GuoRui Pioneering Park, No. 1068 Jinyang East Road, Lujia Town, Kunshan, Suzhou,Jiangsu,China.
Contact Person Eva liu

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