Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards

• The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
• In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
• The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
• The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
• The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.