Simple Operation Laser Depaneling Machine High Precision CCD Automatic Positioning
Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards
450*430 Mm 15W UV PCB Separator / FR4 Board Laser Depaneling Machine ±20 μM Precision
PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision
- The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
- In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
- The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
- The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
- The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.
Laser Depanelizer Machine,YSATM-3L Feature:
1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
3. Reduce energy consumption, Cost savings.
4. Cost-effective, fast cutting speed, stable performance
Laser Depanelizer Machine, YSATM-3L Specification:
| Parameter |
|
|
|
Technical parameters |
Main body of laser | 1480mm*1360mm*1412 mm |
| Weight of the | 1500Kg | |
| Power | AC220 V | |
| Laser | 355 nm | |
| Laser |
Optowave 10W(US) |
|
| Material | ≤1.2 mm | |
| Precisio | ±20 μm | |
| Platfor | ±2 μm | |
| Platform | ±2 μm | |
| Working area | 600*450 mm | |
| Maximum | 3 KW | |
| Vibrating | CTI(US) | |
| Power | AC220 V | |
| Diameter | 20±5 μm | |
| Ambient | 20±2 ℃ | |
| Ambient | ＜60 % | |
| The Machine | Marble | |
Laser Depanelizer Machine Principle
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