High Speed Selective Weave Soldering Machine Conveyor Height 900±20mm
YS-CPS435 Selective Soldering Machine
2700x1735x1415 (mm) 0.5KG/pot/week x4 YS-CPS435 Selective Soldering Machine
Technical Parameters:
| Machine Size | 2700x1735x1415 (mm) |
| PCB size | L400*W350 (mm) |
| Conveyor height | 900±20(mm) |
| Solder pot | electromagnetic pump tin solder pot |
| The amount of tin dross | 0.5KG/pot/week x4 |
| Nitrogen consumption | 1.5-2m³/h/potx1 |
| solder pot numbers | single pot |
FLUX SPRAY MODULE
Introduction:
The spray head which is imported from Germany offers an absolutely precise and well defined flux deposition on even the smallest areas. The flux is targeted to beapplied only to the solder joint,whereby the wettable area can be as small as 3mm.with the effect that ionic contamination is minimized and flux consumption isduced.
Features:
Saving 90%flux compared to traditional mode.The wettable area can be as small as 3mm, minimize the effect of ionic contamination, meanwhile boards cleaning free.Two axis servo motor control, high positioning accuracy.
Minimum ionic contamination.
| Specifications: | |
| Flux module x axis distance (max.) | 510mm |
| Flux module y axis distance (max.) | 450mm |
| Max. nozzle speed | 7m/min |
| Flux content | 2 L |
| Flux type | RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1 |
| Flux effective level | L0, L1, M0 |
| Nozzle | 130 μm, alternative diameter |
| Spray pressure | 0.5~1.0 bar |
| Spray width | 2~8 mm (with spray nozzle 130 μm) |
| Spray speed | 20 mm/s |
| Positioning speed | 400 mm/s |
| Positioning accuracy | ±0.2 mm |
| Flux system | 2-axis With Servo Drive |
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