no vibration resin substrate PCB Laser Depaneling Machine
PCB V-groove Cutting Machine /automatic Aluminum PCBA Separator/laser pcb depaneling machine YSV-2A
specifications:
| Model | YSV-1A |
| Max. PCB cutting length | 460 or 600 mm(on request custom made) |
| PCB cutting thickness | 0.6-3.5 mm |
| PCB cutting speed | 100,200,300,500 mm/sec |
| Blade motion | upper circular blade moving automatically |
| Blade motive power operating mode | motor-driven |
| Power supply | 110/220v |
| PCB cutting machine size | 770*510*450mm |
| PCB cutting machine weight | 55kg |
Features:
1. Easy maintanance and operation
2. Low bending stress,no vibration
3. specially for resin substrate PCB with pre-scored V groove
4. safety use
5. Firm machine structure be designed to prevent electronic circuit, solder point, and solder cutting area of PCB from damage by unsuitable force.
6. Effectively reduce stress and prevent solder point chap from PCB cutting.
7. PCB cutting speed can be adjusted by the rotary knob
8. PCB cutting stroke can be set free and setting value can be showed in LCD
9. Clearance between circular and linear blades are adjusted to fit different V groove depth and compensates for blade wear out
10. Optional PCB conveyor belt to remove finished PCB cut
If you are interseting in our product,please contact us!
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