Humanized Design Automatic Stencil Inspection Visual Solder Paste Printer For PCB
Automatic stencil inspection function Fully Automatic Visual Solder Paste Printer-YSL- A-BTB
product technical points :
● Humanized design
● Back to back mode,machine independent control
● Unique sprinkler automatic cleaning system
● Effcient energy - saving wiping paper -saving structure
● Unique image processing system
● Intelligent printing production system
● Printing range: 400*310mm
● Use international universal UVW three axis linkage platform
● Machine demensions range: 1220X1350X1500mm(one) 1220X2800X1500(two set )
● Machine option : automatic add solder paste function. automatic stencil inspection function .automatic dispensing system .squeegee pressure feedback function .automatic MSE/SPI online function .automatic constant temperature and humidity function
| Model | YSL-A-BIB | IMAGE RECOGNITION | |||
| Item | CCD FOV | 10x8 mm | |||
| Screen Frames | Min Size | 470X370mm | Fiducial Types | □square○Round △Triangle,+cross Pad Hole | |
| Max Size | 737X550mm737X650mm(200-310) | | CCD digital camera | ||
| Thickness | 25-40mm | Geometrypattern match | |||
| PCB Min Size | 50X50mm | Lookup down optics structure | |||
| PCB Max Size | 400X310mm | Working environment temperature | -21-℃-+50℃ | ||
| PCB Thickness | 0.4-6mm | Humidity of working environment | 30%-60% | ||
| PCB Warpage | <1% | Power input | AC:220±10%50/60HZ 1&3KW | ||
| Transport Height | 900±40mm | Control Method | PC Control | ||
| Transport Direction | Left-Right:Right-Left:Left-Left;Right-Right | Machine Dimensions | 1220(L)X1355W)X1500(H)mm | ||
| Transport Speed | Max1500mm/S Programmable | Machine Weight | Approx:1000Kg()2000KG() | ||
| Board Location PCB | Support System | Magnetic Pin/Up-down table adjusted/support block by hand | PRINTING PARAMETERS | ||
| Clamping System | side clamping.vacuum nozzle | PCB Max Size | 400X310mm | ||
| Print head | Two independent motorised printheads | Squeegee Type | Stainless steel(Standard),plastic | ||
| Cleaning System | Dry,Wet,Vacuum(Programmable) | Substrate Separation | 0.1~20mm/sec | ||
| Table Adjustment ranges | X:±10mm;Y:± 10mm;;±2º | Separation option | Separation after squeegee up;Squeegee up after separation by keeping squeegee on the stencil | ||
| Solder Paste Inspection | 2DInspection | Squeegee Speed | 6-200mm/sec | ||
| Squeegee Pressure | 0~15Kg | ||||
| Squeegee Angle | 60º/55º/45º | ||||
| Repeat Position Accuracy | ±0.008mm(CPK>2.0) | ||||
| Printing Accuracy | ±0.02mm(CPK=>2.0 | ||||
| Cycle Time | <7s(Exclude Printing Cleaning) | ||||
| Product Changeover | <5Min | ||||
| Air Required | 4.5-6 Kg/cm2 | ||||
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