Kovar Alloy - Strip of Sealing Alloy 4J29 for Integrated Circuit Framework
Kovar Alloy - Strip of Sealing Alloy 4J29 for Integrated Circuit Framework
Application: Vacuum device main seal structure material
Feature: At 20 to 450 degrees and having a linear expansion coefficient similar borosilicate hard glass, high Curie point, has good low temperature stability of the organization. Suitable for use in mercury discharge instrument. Rectangular hysteresis loop.
Specifications
|
Grade |
4J29- Strip |
|
Thickness |
0.01~5mm |
|
Width |
4~250mm |
|
Weight of coil |
2-50 kgs |
|
Condition |
Soft/ Hard; Bright/ Oxidized |
Chemical composition(%)
|
Grade |
C |
Si |
Mn |
P |
S |
Ni |
Cu |
Cr |
Mo |
Co |
Fe |
|
4J29 |
≤0.03 |
≤ 0.3 |
≤ 0.5 |
≤0.02 |
≤0.02 |
28.5~29.5 |
≤ 0.2 |
≤0.2 |
≤0.2 |
16.8~17.8 |
Bal. |
Physical properties
- Density (g/cm3): 8.17
- Elastic Modulus (MPa): 165*103
- Mean Coefficient of Thermal Expansion (10-6/℃): 5.0 (20~400℃); 5.2 (20~450℃)
- Curie point (℃): 430
- Electrical resistivity (μΩ*cm): 46 (20℃)
- Specific heat (J/kg*℃): 418
- Thermal conductivity ( W/m. ℃): 20.3
Mechanical properties
|
|
|
Yield Strength (Mpa) |
Tensile Strength (Mpa) |
Elongation, % |
Hardness, HV |
|
4J29 |
Cold-rolling |
695 |
780 |
5 |
230 |
|
As annealed |
315 |
520 |
24 |
148 |
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