Shanghai Tankii Alloy Material Co.,Ltd
                                                                                                           
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45 Years
Since 1981
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16×500×500mm Pure Copper Foam Sheet with 98% Porosity and 90-120 PPI for Battery Electrodes and Thermal Management

Price Negotiable
Price: USD+ 14.6-19.8 + m2
MOQ: 10 square meter
Delivery Time: 7-10days
Brand: TANKII
Product Description
Pure Copper Foam Sheet Overview

This 16×500×500mm pure copper foam sheet is a high-porosity metallic material manufactured to GB/ASTM standards, featuring exceptional thermal and electrical conductivity properties ideal for various industrial applications.

Key Applications
  • Electrode substrate for lithium-ion batteries, fuel cells, and nickel-zinc batteries
  • Electric double layer capacitor electrode material
  • Heat sink and heat absorption materials
  • Chemical catalyst carrier and filtration materials
  • Electromagnetic shielding and damping materials
  • High-grade decorative applications
Technical Specifications
Continuous Copper Foam Performance
Parameter Specification
Thickness (0.3~2.5)±0.05mm
PPI (Pores Per Inch) 90~120
Surface Density (250~1800)±30g/m²
Tensile Strength (Vertical) ≥130N/cm²
Tensile Strength (Horizontal) ≥100N/cm²
Elongation (Vertical) ≥5%
Elongation (Horizontal) ≥12%
Porosity ≥98%
Width (50~1000)±0.5mm
Ratio Resistance ≤5×10⁻⁶
Product Images
Pure copper foam sheet showing porous structure and metallic surface Close-up view of copper foam material highlighting high porosity and uniform cell structure Industrial application of copper foam in battery and thermal management systems
Material Characteristics

Copper foam is characterized by extremely high porosity exceeding 98%, creating a permeable material with exceptional surface area-to-volume ratio. This unique structure provides outstanding performance in heat exchange, energy absorption, flow diffusion, and lightweight applications.

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Company Shanghai Tankii Alloy Material Co.,Ltd
Location 1900 Mudanjiang Road, Baoshan District, 201999, Shanghai, China
Contact Person Martin Lee

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