2.0mm pitch on board surface wire to board connector single row wire housing DF3 connector
1, Detailed specification for your inforamtion
|
Basic size information |
|||
| Suitable terminals | A2005 series | ||
| Suitable wafer | A2005 series | ||
| Mating lock | without | ||
| Wire Termination Method | Crimping | ||
| Circuits | 2 to 15 pins | ||
| Wire Insulation Diameter | 1.45mm Max. | ||
| Mounting side | Standard on-Board | ||
| Terminals material | phosphor bronze; tin-plated finish | ||
| Electrical properties | |||
| Current Rating | 3A AC, DC | ||
| Voltage Rating | 250V AC, DC | ||
| Contact Resistance | 30mΩ Max | ||
| Insulation Resistance | 1000mΩ min | ||
| Withstanding Voltage | 650V AC/minute | ||
| Mechanical properties | |||
| Operating temperature range | -25℃ to 85 ℃ | ||
| Other information please kindly check the following picture. | |||
2, Related dimension drawing and testing report
Please kindly check the below pictures, wish it can help you a lot to get what you exactly need.
Mechanical Performance
| Test Description | Procedure | Requirement | ||
| 5-1 | Actuator Insertion & Withdrawal Force | Insert and withdraw connectors at the speed rate of 25±3mm / minute. | Refer to paragraph 7-2 | |
| 5-2 | Crimping Pull Out Force | Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8) | AWG#22 | 5.0kgf (Min) |
| AWG#24 | 3.0kgf (Min) | |||
| AWG#26 | 2.0kgf (Min) | |||
| AWG#28 | 1.0kgf (Min) | |||
| 5-3 | Terminal Insertion Force. | Insert the crimped terminal into the housing. | 1.50kgf (Max.) | |
| 5-4 | Terminal/Housing Retention Force. | Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing. | 1.50kgf (Min.) | |
| 5-5 | Pin Retention Force | Apply axial push force at the speed rate of 25±3mm / minute | 1.00kgf (Min.) | |
| 5-7 | Durability | When mated up to 30 cycles repeatedly by the rate of 10 cycle per minute. | Contact Resistance 40mΩ (Max.) | |
| 5-8 | Vibration |
Amplitude: 1.5mm P-P Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes. (Based upon MIL-STD-202 Method 201A) |
Appearance No Damage. Contact Resistance 40mΩ (Max.) Discontinuity 1 μsec.(Max.) |
|
| 5-9 | Physical Shock | 490m/s²｛50G｝,3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A) | ||
Environmental Performance And Others
| Test Description | Procedure | Requirement | |
| 6-1 | Temperature Rise | Carrying rated current load.(Based upon UL 498) | 30℃(Max.) |
| 6-2 | Heat Resistance | 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A) |
Appearance No Damage. Contact Resistance 40mΩ (Max.) |
| 6-3 | Cold Resistance | -25±3℃,96 hours (Based upon JIS C0020) | |
| 6-4 | Humidity |
Temperature: 40±2℃ Relative Humidity : 90~95% Duration: 96 hours (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B) |
Appearance No Damage. Contact Resistance 40mΩ (Max.) Insulation Resistance 100MΩ (Min.) Dielectric Withstanding Voltage Must meet 4-3 |
| 6-5 | Temperature Cycling |
5 cycles of: a) -55℃ 30 minutes b) +85℃ 30 minutes (Based upon JIS C0025) |
Appearance No Damage. Contact Resistance 40mΩ (Max.) |
| 6-6 | Salt Spray | Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B) | |
| 6-7 | SO2 Gas |
24 hours exposure to 50±5ppm. SO2 gas at 40±2℃. |
|
| 6-8 | NH3 Gas | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | |
| 6-9 | Solderability |
Soldering Time: 5±0.5 sec. Solder Temperature: 245±5℃ |
Solder Wetting 95% of immersed area must show no voids, pin holes |
3, Our Modes of Delivery & Payment
In order to make you pay money easily, we offer various payment modes, formore, the multiple delivery way can meet your different demands like shipping time, shipping cost.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.