Automotive connector 2.0mm Pitch PAD Wire To Board Connectors Dual row Housing Type
1, The detailed specification
| Basic size information | |||
| Suitable terminals | A2001T series | ||
| Suitable wafer | A2009W series | ||
| Mating lock to part | yes | ||
| Wire Termination Method | crimping | ||
| Circuits | 18pins, 22pins | ||
| Wire Insulation Diameter | 1.30mm Max. | ||
| Mounting side | Standard on-Board | ||
| Terminals material | phosphor bronze; tin-plated /gold-flash finish | ||
| Electrical properties | |||
| Current Rating | 3A AC, DC | ||
| Voltage Rating | 250V AC, DC | ||
| Contact Resistance | 20mΩ Max | ||
| Insulation Resistance | 1000mΩ min | ||
| Withstanding Voltage | 1000V AC/minute | ||
| Mechanical properties | |||
| Operating temperature range | -25℃ to 85 ℃ | ||
| Other information please kindly check the following picture. | |||
2, Related engineering drawing and testing report
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Environmental Performance And Others
| Test Description | Procedure | Requirement | |
| 6-1 | Temperature Rise | Carrying rated current load.(Based upon UL 498) | 30℃(Max.) |
| 6-2 | Heat Resistance | 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A) |
Appearance No Damage. Contact Resistance 20mΩ (Max.) |
| 6-3 | Cold Resistance | -25±3℃,96 hours (Based upon JIS C0020) | |
| 6-4 | Humidity |
Temperature: 40±2℃ Relative Humidity : 90~95% Duration: 96 hours (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B) |
Appearance No Damage. Contact Resistance 20mΩ (Max.) Insulation Resistance 100MΩ (Min.) Dielectric Withstanding Voltage Must meet 4-3 |
| 6-5 | Temperature Cycling |
5 cycles of: a) -55℃ 30 minutes b) +85℃ 30 minutes (Based upon JIS C0025) |
Appearance No Damage. Contact Resistance 20mΩ (Max.) |
| 6-6 | Salt Spray | Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B) | |
| 6-7 | SO2 Gas |
24 hours exposure to 50±5ppm. SO2 gas at 40±2℃. |
|
| 6-8 | NH3 Gas | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | |
| 6-9 | Solderability |
Soldering Time: 5±0.5 sec. Solder Temperature: 245±5℃ |
Solder Wetting 95% of immersed area must show no voids, pin holes |
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