1.5 W / M * K Conductive Silicone Pad For Heat Sink Chip Cooling Heatsink

1.5 W / M * K Conductive Silicone Pad For Heat Sink Chip Cooling Heatsink
 

 
1, The main purpose of the selection of Conductive Silicone Pad to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat dissipation device, Conductive Silicone Pad can fill the gap of the contact surface well;
 
2, The air is a bad conductor of heat will seriously hinder the transfer of heat between the contact surface, and the heat transfer Conductive Silicone Pad between the heat source and the radiator can squeeze the air out of the contact surface;
 
3, With the supplement of heat-conducting Conductive Silicone Pad, can make the contact surface between the heat source and the radiator better and full contact, really face-to-face contact, so that the reaction on the temperature can be as small as possible.
 

 
A)How could I get a sample?
Before we received the first order, please afford the sample cost and express fee. We will return the sample cost back to you within your first order.
B)Sample time?
Usually within 10-30 days.
C) Whether you could make our brand on your products?
Yes. We can print your Logo on both the conductive Silicone Pad and the packages if you can meet our MOQ.
D) Whether you could make your products by our color?
Yes, The color of products can be customized if you can meet our MOQ,and pls send the color chart.
E) How to guarantee the quality of Conductive Silicone Pad​ ?
1) Strict detection during production.
2) Strict sampling inspection on products before shipment and intact product packaging ensured.
F) : Do you accept R & D assignments?
Yes, we can according to Your Design Requirements of individual R & D.