Aluminum Liquid Cooling Plate Microchannel Roll Bonded for Data Center Server CPU Thermal Management
Aluminum Liquid Cooling Plate for Data Center Server CPU Thermal Management
High-density data centers and servers demand thermal solutions capable of handling concentrated heat. Our aluminum liquid cooling plate uses a microchannel roll bonded construction to manage high heat flux, dissipating heat efficiently while keeping a compact footprint for tight server and rack layouts.
Key Advantages
- Microchannel internal structure for high heat flux dissipation and fast heat transfer
- Compact, lightweight aluminum design suited to space-constrained server enclosures
- Uniform coolant flow that avoids local hot spots on high-power CPUs
- Reliable roll bonded construction with strict leak testing before delivery
- Custom dimensions and connector positions for diverse server and rack form factors
Technical Specifications
| Item | Specification |
|---|---|
| Material | Aluminum alloy |
| Process | Microchannel roll bonding |
| Cooling Type | Liquid cooling |
| Application | Data center server CPU cooling |
| Dimensions | Customized to server design |
Customization
Plate dimensions, inlet and outlet positions, mounting features, and surface treatments can be customized to match specific server and rack requirements. Contact our engineering team to discuss your data center cooling project.
About Trumony
Trumony supports the development and mass production of aluminum liquid cooling components across energy storage, EV, and data center applications, delivering reliable, cost-effective thermal management solutions worldwide.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.