9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
Price:
Negotiation
MOQ:
200 kg
Delivery Time:
5-8 days
Brand:
HUITIAN
Product Description
9504 One-Component Pre-Curing Type Thermal Gel, which has no residual stress after sizing, effectively protects precision electronic components from damage
Product Description
- Pink paste gel
- One-part pre-curing type
- Silicone thermal conductivity complex
Product Features:
- High thermal conductivity 4W/m∙K
- Very small BLT and very low thermal resistance
- Soft adhesion and self-adhesive properties after dispensing
- Excellent chemical and mechanical stability
- No residual stress after sizing, effectively protects precision electronic components from damage
Technical Parameters
| Reference standard | Item | Unit | Value |
| GB/T 13354 | Density | g/cm3 | 3.2 |
| -- | Extrusion rate
(30ccEFD@90psi)
|
g/min | 30 |
| ISO22007 | Thermal conductivity | W/ m·K | 4.0 |
| GB/T2408 | Flame retardant | / | V0 |
| GB/T2408 | Volume resistivity | Ω·cm | ≥1.0×1013 |
| ASTM D149 | Dielectric strength | Kv/mm | 8.0 |
| ASTM D5470 | Minimum thickness | mm | 0.1 |
Main Applications:
- Bare die chip low-stress mounting
- Heat dissipation field of 5G communication boards
- Automotive electronic equipment
- Smart phone modules and consumer-electronics
- Other high-value boards need to be reworked
Packing:
30cc/tube; 300cc/tube
Storage:
Store below 35°C in a cool and dry place.
Shelf life is 6 months.
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Company
Shanghai Huitian New Material Co., Ltd
Location
No. 251, Wenji Road, Songjiang District, Shanghai China
Contact Person
Simon Dou