Chemicals Adhesives & Sealants

5296 Two-Part Addition-Type Potting Adhesive For Power Supplies, Connectors, Sensors, Industrial Controls

Price Negotiable
Price: Negotiation
MOQ: 500KG
Delivery Time: 5-8 days
Brand: Huitian
Product Description

 

5296 is a Two-Part Addition-Type Potting Silicone. It has a long operating time at room temperature and if heated can accelerate the curing speed. It has excellent thermal stability, especially high temperature-stability. When it has completely cured, the rubber elasticity can maintain at a wider temperature range,and its insulating quality is also very excellent too. It has very low thermal expansion, good water resistant and ageing resistant. It has low viscosity and high thermal conductivity, and is compatible with most electrical insulating materials.

 

 

Applications
All kinds of electrical components of thermal conductivity, flame retardant potting, such as photovoltaic inverters, LED drive power.charging piles, automotive electronics, NEV power, controllers etc.

 

Product Features

1) High thermal conductivity and flowability

2) Both room temperature and heat curing

3) Good weather and aging resistance

4) Excellent insulation properties

5) Flame retardant UL94V-0

6) Maintains rubber elasticity from -50°C to 200°C

7) RoHS Directive

 

Technical parameters

Reference standard1 Item Unit Value
Physical properties before curing (25±2℃, 60%±5%RH)
Q/HTXC 2 Appearance (A) -- Grey fluid
  Appearance (B) -- White fluid
GB/T2794 Viscosity (A) mPa·s 3500~5500
  Viscosity (B) mPa·s 2800~4800
GB/T13354 Density (A) g/cm3 1.91±0.05
  Density (B) g/cm3 1.95±0.05
Physical properties after curing (25±2℃, 60±5%RH, A:B=1:1)
Q/HTXC 2 Operating time min 60~180
Q/HTXC 2 Gel time (25℃) h 3~5
Q/HTXC 2 Gel time (80℃) min ≤30
GB/T 531 Hardness (ShoreA) -- 30~40
Q/HTXC 2 Dielectric strength KV/mm ≥18
Q/HTXC 2 Volume resistivity Ω·cm ≥1.0×1014
IS0 22007-2 Thermal conductivity W/m·K 0.9~1.0

 

 

Cautions
Store the product in a sealed container, and keep it away from children for storage.

The glue will not cure if exposed to a certain amount of the following chemicals:

Organic compounds of N, P, and S, ionic compounds of Sn, Pb, Hg, As, etc.;

Compounds containing alkyne and polyvinyl.

To avoid the above problem, Any residual rosin on the circuit board should be wiped clean when using the glue, and use soldering tin with low lead content.

This product is non-hazardous. Please consult the MSDS of the product for safety information.

 

Packaging

25kg/barrel, 10kg/barrel

 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shanghai Huitian New Material Co., Ltd
Location No. 251, Wenji Road, Songjiang District, Shanghai China
Contact Person Simon Dou

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